Footprints
1,486 footprints matching “5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Buzzer_TDK_PS1240P02BT_D12.2mm_H6.5mm
Buzzer_Beeper
Buzzer, D12.2mm height 6.5mm, https://product.tdk.com/info/en/catalog/datasheets/piezoelectronic_buzzer_ps_en.pdf
- Pads
- 2
- THT
- 12.7×12.7
- Boards
- 79
C_Axial_L3.8mm_D2.6mm_P7.50mm_Horizontal
Capacitor_THT
C, Axial series, Axial, Horizontal, pin pitch=7.5mm, length*diameter=3.8*2.6mm^2, http://www.vishay.com/docs/45231/arseries.pdf
- Pads
- 2
- THT
- 9.6×3.1
- Boards
- 79
SSOP-20_5.3x7.2mm_P0.65mm
Package_SO
SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)
- Pads
- 20
- SMD
- 9.4×7.7
- Boards
- 77
C_Rect_L7.0mm_W3.5mm_P5.00mm
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7*3.5mm^2, Capacitor
- Pads
- 2
- THT
- 7.5×4.0
- Boards
- 74
C_Disc_D7.5mm_W2.5mm_P5.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=5.00mm, diameter*width=7.5*2.5mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf
- Pads
- 2
- THT
- 8.0×3.0
- Boards
- 73
C_Rect_L4.0mm_W2.5mm_P2.50mm
Capacitor_THT
C, Rect series, Radial, pin pitch=2.50mm, length*width=4*2.5mm^2, Capacitor
- Pads
- 2
- THT
- 4.6×3.0
- Boards
- 69
TSOP-6_1.65x3.05mm_P0.95mm
Package_SO
TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 6
- SMD
- 3.5×3.5
- Boards
- 69
Fuse_0603_1608Metric_Pad1.05x0.95mm_HandSolder
Fuse
Fuse SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 3.3×1.5
- Boards
- 68
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))
- Pads
- 9
- SMD
- 6.7×5.5
- Boards
- 68
C_Radial_D5.0mm_H11.0mm_P2.00mm
Capacitor_THT
C, Radial series, Radial, pin pitch=2.00mm, diameter=5mm, height=11mm, Non-Polar Electrolytic Capacitor
- Pads
- 2
- THT
- 5.5×5.5
- Boards
- 65
R_Axial_DIN0414_L11.9mm_D4.5mm_P15.24mm_Horizontal
Resistor_THT
Resistor, Axial_DIN0414 series, Axial, Horizontal, pin pitch=15.24mm, 2W, length*diameter=11.9*4.5mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf
- Pads
- 2
- THT
- 18.1×5.0
- Boards
- 62
LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y
Package_LGA
LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)
- Pads
- 16
- SMD
- 3.5×3.5
- Boards
- 61
CP_Axial_L10.0mm_D4.5mm_P15.00mm_Horizontal
Capacitor_THT
CP, Axial series, Axial, Horizontal, pin pitch=15mm, length*diameter=10*4.5mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/28325/021asm.pdf
- Pads
- 2
- THT
- 17.5×5.0
- Boards
- 60
Bosch_LGA-14_3x2.5mm_P0.5mm
Package_LGA
LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf
- Pads
- 14
- SMD
- 3.7×3.2
- Boards
- 60
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
TQFP-64_10x10mm_P0.5mm
Package_QFP
TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 64
- SMD
- 13.3×13.3
- Boards
- 58
Altech_AK300_1x02_P5.00mm_45-Degree
TerminalBlock_Altech
Terminal block Altech AK300, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 10x12.5mm, drill diameter 1.3mm, pad diameter 3mm, https://www.altechcorp.com/PDFS/PCBMETRC.PDF#page=5
- Pads
- 2
- THT
- 11.0×13.5
- Boards
- 58
SSOP-8_2.95x2.8mm_P0.65mm
Package_SO
SSOP-8 2.9 x2.8mm Pitch 0.65mm
- Pads
- 8
- SMD
- 5.5×3.3
- Boards
- 57
Crystal_SMD_SeikoEpson_FA238-4Pin_3.2x2.5mm
Crystal
Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 4.2×3.5
- Boards
- 56
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
LGA-8_3x5mm_P1.25mm
Package_LGA
LGA-8
- Pads
- 8
- SMD
- 3.6×5.5
- Boards
- 55
TerminalBlock_Phoenix_MKDS-1,5-4_1x04_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-4, 4 pins, pitch 5mm, size 20x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 4
- THT
- 21.0×10.8
- Boards
- 55
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54