Footprints
148 footprints matching “SO-8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Infineon_PG-HSOF-8-1_ThermalVias
Package_TO_SOT_SMD
HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)
- Pads
- 3
- SMD
- 13.8×10.6
- Boards
- 6
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
Oscillator_DIP-8_LargePads
Oscillator
Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf
- Pads
- 4
- THT
- 13.2×13.2
- Boards
- 4
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 4
Analog_LCC-8_5x5mm_P1.27mm
Package_LCC
LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf
- Pads
- 8
- SMD
- 6.3×6.4
- Boards
- 4
SIP-8_19x3mm_P2.54mm
Package_SIP
SIP 8-pin (http://www.njr.com/semicon/PDF/package/SIP8_E.pdf)
- Pads
- 8
- THT
- 19.7×3.5
- Boards
- 4
SOIC-8-N7_3.9x4.9mm_P1.27mm
Package_SO
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF)
- Pads
- 7
- SMD
- 7.5×5.4
- Boards
- 4
SSO-8_6.7x9.8mm_P2.54mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf
- Pads
- 8
- SMD
- 11.9×10.3
- Boards
- 4
WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.9×3.5
- Boards
- 4
TSOT-23-8_HandSoldering
Package_TO_SOT_SMD
8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf
- Pads
- 8
- SMD
- 5.9×3.4
- Boards
- 4
Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 2.9×3.9
- Boards
- 3
DIP-8-N7_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- 3
PowerIntegrations_SMD-8
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 8
- SMD
- 11.1×10.7
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
SOP-8_6.605x9.655mm_P2.54mm
Package_SO
SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)
- Pads
- 8
- SMD
- 11.5×10.2
- Boards
- 3
SC-70-8
Package_TO_SOT_SMD
SOT, 8 Pin (JEDEC MO-203, variant BA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-sc-70/sot_8_05-08-1639.pdf)
- Pads
- 8
- SMD
- 2.9×2.2
- Boards
- 3
TerminalBlock_Phoenix_MKDS-3-8-5.08_1x08_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-3-8-5.08, 8 pins, pitch 5.08mm, size 40.6x11.2mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/2138224.pdf
- Pads
- 8
- THT
- 41.6×12.2
- Boards
- 3
TE_1-84953-8_1x18-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 18 top-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4
- Pads
- 19
- SMD
- 26.9×10.3
- Boards
- 2
TE_84953-8_1x08-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 08 top-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4
- Pads
- 9
- SMD
- 16.9×10.3
- Boards
- 2