Footprints
198 footprints matching “SOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 5
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
TSOP-I-32_11.8x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 14.9×8.5
- Boards
- 4
TSOP-I-32_12.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)
- Pads
- 32
- SMD
- 15.5×8.5
- Boards
- 4
TSSOP-14-1EP_4.4x5mm_P0.65mm
Package_SO
14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)
- Pads
- 15
- SMD
- 7.9×5.6
- Boards
- 4
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm_ThermalVias
Package_SO
MSOP, 8 Pin (https://www.diodes.com/assets/Package-Files/MSOP-8EP.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 3
QSOP-20_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 20
- SMD
- 7.4×9.2
- Boards
- 3
SOP-8_6.605x9.655mm_P2.54mm
Package_SO
SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)
- Pads
- 8
- SMD
- 11.5×10.2
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
TSOP-I-32_14.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB)
- Pads
- 32
- SMD
- 17.5×8.5
- Boards
- 3
TSOP-I-32_18.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD)
- Pads
- 32
- SMD
- 21.5×8.5
- Boards
- 3
TSOP-I-56_18.4x14mm_P0.5mm
Package_SO
TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)
- Pads
- 56
- SMD
- 21.5×14.5
- Boards
- 3
TSSOP-30_4.4x7.8mm_P0.5mm
Package_SO
TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 30
- SMD
- 7.7×8.3
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm_ThermalVias
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 2
MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
Package_SO
MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf)
- Pads
- 17
- SMD
- 6.3×4.5
- Boards
- 2