Footprints

317 footprints matching “pd”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

317 footprints · page 4 of 14

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DIP-8_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 8
SMD: 10.7×10.8
Boards: 14

SMDIP-16_W9.53mm

FP3D

Package_DIP

16-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 16
SMD: 12.0×20.8
Boards: 14

Relay_StandexMeder_DIP_LowProfile

FP3D

Relay_THT

package for Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf

Pads: 8
THT: 9.8×20.4
Boards: 14

SMDIP-4_W7.62mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 4
SMD: 10.1×5.6
Boards: 13

Texas_S-PDSO-N12

FP3D

Package_SON

http://www.ti.com/lit/ds/symlink/bq27441-g1.pdf

Pads: 13
SMD: 4.9×3.4
Boards: 13

DIP-32_W7.62mm

FP3D

Package_DIP

32-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 32
THT: 9.8×41.3
Boards: 12

DIP-48_W15.24mm

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 48
THT: 17.3×61.5
Boards: 12

DIP-14_W10.16mm

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 14
THT: 12.3×18.3
Boards: 11

DIP-16_W10.16mm_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 16
THT: 13.1×20.8
Boards: 11

DIP-16_W10.16mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 16
THT: 12.3×20.8
Boards: 10

DIP-16_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 16
SMD: 10.7×20.9
Boards: 10

Relay_SPDT_HJR-4102

FP3D

Relay_THT

IM Signal Relay SPDT HJR-4102

Pads: 6
THT: 10.4×14.7
Boards: 10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9