Footprints

502 footprints matching “+-1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

502 footprints · page 5 of 21

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UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm

FP3D

Package_DFN_QFN

UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf

Pads: 5
SMD: 1.8×1.5
Boards: 12

TerminalBlock_Phoenix_PT-1,5-8-5.0-H_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-5.0-H, 8 pins, pitch 5mm, size 40x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf

Pads: 8
THT: 41.0×10.0
Boards: 12

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 11

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 11

AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)

Pads: 5
SMD: 6.7×5.7
Boards: 10

DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm

FP3D

Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: 10

QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)

Pads: 33
SMD: 5.2×5.2
Boards: 10

D_T-1_P10.16mm_Horizontal

FP3D

Diode_THT

Diode, T-1 series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf

Pads: 2
THT: 12.7×3.1
Boards: 9

DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm

FP3D

Package_DFN_QFN

DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)

Pads: 7
SMD: 3.1×2.6
Boards: 9

QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads: 33
SMD: 5.2×5.2
Boards: 9

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 9

Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)

Pads: 21
SMD: 6.3×6.3
Boards: 9

Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)

Pads: 25
SMD: 5.3×5.3
Boards: 9

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias

FP3D

Package_SO

HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)

Pads: 25
SMD: 7.8×8.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9