Footprints
510 footprints matching “T-1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 13
TerminalBlock_Phoenix_MKDS-1,5-8-5.08_1x08_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-8-5.08, 8 pins, pitch 5.08mm, size 40.6x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 8
- THT
- 41.6×10.8
- Boards
- 13
L_Axial_L5.3mm_D2.2mm_P10.16mm_Horizontal_Vishay_IM-1
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=5.3*2.2mm^2, Vishay, IM-1, http://www.vishay.com/docs/34030/im.pdf
- Pads
- 2
- THT
- 12.3×2.7
- Boards
- 12
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 12
UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
Package_DFN_QFN
UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf
- Pads
- 5
- SMD
- 1.8×1.5
- Boards
- 12
TerminalBlock_Phoenix_PT-1,5-8-5.0-H_1x08_P5.00mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-8-5.0-H, 8 pins, pitch 5mm, size 40x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf
- Pads
- 8
- THT
- 41.0×10.0
- Boards
- 12
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm
Package_QFP
TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 11
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 11
AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)
- Pads
- 5
- SMD
- 6.7×5.7
- Boards
- 10
DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm
Package_DFN_QFN
DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)
- Pads
- 7
- SMD
- 3.8×3.7
- Boards
- 10
QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 10
D_T-1_P10.16mm_Horizontal
Diode_THT
Diode, T-1 series, Axial, Horizontal, pin pitch=10.16mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf
- Pads
- 2
- THT
- 12.7×3.1
- Boards
- 9
DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm
Package_DFN_QFN
DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)
- Pads
- 7
- SMD
- 3.1×2.6
- Boards
- 9
QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm
Package_DFN_QFN
QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- 9
QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 9
Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm_ThermalVias
Package_DFN_QFN
Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)
- Pads
- 21
- SMD
- 6.3×6.3
- Boards
- 9
Texas_RTW_WQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
Texas RTW WQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 9
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 9
D_T-1_P2.54mm_Vertical_AnodeUp
Diode_THT
Diode, T-1 series, Axial, Vertical, pin pitch=2.54mm, length*diameter=3.2*2.6mm^2, http://www.diodes.com/_files/packages/T-1.pdf
- Pads
- 2
- THT
- 5.3×3.1
- Boards
- 8
LFCSP-24-1EP_4x4mm_P0.5mm_EP2.3x2.3mm
Package_CSP
LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-24/cp_24_14.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 8
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 8