Footprints

377 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

377 footprints · page 5 of 16

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DIP-8_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 8
SMD: 10.7×10.8
Boards: 14

SMDIP-16_W9.53mm

FP3D

Package_DIP

16-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads: 16
SMD: 12.0×20.8
Boards: 14

TO-92L

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads: 3
THT: 5.5×4.6
Boards: 14

SMDIP-4_W7.62mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 4
SMD: 10.1×5.6
Boards: 13

PowerIntegrations_SO-8

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf

Pads: 8
SMD: 8.0×5.4
Boards: 13

SSO-8_6.8x5.9mm_P1.27mm_Clearance8mm

FP3D

Package_SO

8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true

Pads: 8
SMD: 13.1×6.4
Boards: 13

DIP-32_W7.62mm

FP3D

Package_DIP

32-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 32
THT: 9.8×41.3
Boards: 12

DIP-48_W15.24mm

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 48
THT: 17.3×61.5
Boards: 12

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

DIP-14_W10.16mm

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 14
THT: 12.3×18.3
Boards: 11

DIP-16_W10.16mm_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 16
THT: 13.1×20.8
Boards: 11

AO_DFN-8-1EP_5.55x5.2mm_P1.27mm_EP4.12x4.6mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf)

Pads: 5
SMD: 6.7×5.7
Boards: 10

DIP-16_W10.16mm

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 16
THT: 12.3×20.8
Boards: 10

DIP-16_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 16
SMD: 10.7×20.9
Boards: 10

DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm

FP3D

Package_DFN_QFN

DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)

Pads: 7
SMD: 3.1×2.6
Boards: 9

DIP-10_W7.62mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 10
THT: 9.7×13.2
Boards: 9

DIP-4_W10.16mm

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 4
THT: 12.3×5.6
Boards: 9

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads: 33
SMD: 9.0×11.6
Boards: 9