Footprints

317 footprints matching “pd”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

317 footprints · page 5 of 14

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Oscillator_SeikoEpson_SG-8002DC

FP3D

Oscillator

8-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 4
THT: 9.8×14.0
Boards: 6

DIP-4_W7.62mm_Socket

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 4
THT: 10.7×5.7
Boards: 6

DIP-6_W10.16mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 6
THT: 12.3×8.1
Boards: 6

DIP-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 6
SMD: 10.7×8.2
Boards: 6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-6_W9.53mm_Clearance8mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 6
SMD: 11.5×8.1
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

Relay_DPDT_Kemet_EE2_NU

FP3D

Relay_SMD

Kemet signal relay, DPDT, double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf

Pads: 8
SMD: 10.8×15.5
Boards: 6

Relay_DPDT_Omron_G6K-2G-Y

FP3D

Relay_SMD

Omron G6K-2G-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf

Pads: 8
SMD: 8.0×10.5
Boards: 6

SW_E-Switch_EG2219_DPDT_Angled

FP3D

Button_Switch_THT

E-Switch slide switch, EG series, DPDT, right angle, http://spec_sheets.e-switch.com/specs/P040170.pdf

Pads: 6
THT: 14.5×16.8
Boards: 5

DIP-14_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 14
SMD: 10.7×18.4
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

BatteryHolder_MPD_BC2AAPC_2xAA

FP3D

Battery

2xAA cell battery holder, Memory Protection Devices P/N BC2AAPC, http://www.memoryprotectiondevices.com/datasheets/BC2AAPC-datasheet.pdf

Pads: 2
THT: 59.0×31.5
Boards: 4

DIP-10_W7.62mm_LongPads

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 10
THT: 10.5×13.2
Boards: 4

DIP-12_W7.62mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 12
THT: 9.7×15.7
Boards: 4

DIP-48_W15.24mm_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads

Pads: 48
THT: 18.1×61.5
Boards: 4

Vishay_HVM-DIP-3_W7.62mm

FP3D

Package_DIP

3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf

Pads: 3
THT: 9.9×5.5
Boards: 4

Relay_DPDT_AXICOM_IMSeries_JLeg

FP3D

Relay_SMD

http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Specification+Or+Standard%7F108-98001%7FW5%7Fpdf%7FEnglish%7FENG_SS_108-98001_W5.pdf

Pads: 8
SMD: 6.9×10.5
Boards: 4