Footprints

510 footprints matching “T-1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

510 footprints · page 6 of 22

Matched by name and keywords. Search by meaning instead

QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)

Pads: 21
SMD: 6.2×6.2
Boards: 8

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 8

WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm

FP3D

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads: 9
SMD: 5.2×3.5
Boards: 8

WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm

FP3D

Package_DFN_QFN

http://www.onsemi.com/pub/Collateral/510CD.PDF

Pads: 21
SMD: 4.0×6.0
Boards: 8

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 8

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

TerminalBlock_Phoenix_MKDS-1,5-8_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-8, 8 pins, pitch 5mm, size 40x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 8
THT: 41.0×10.8
Boards: 8

TerminalBlock_Phoenix_PT-1,5-10-5.0-H_1x10_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-10-5.0-H, 10 pins, pitch 5mm, size 50x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf

Pads: 10
THT: 51.0×10.0
Boards: 8

TerminalBlock_Phoenix_PT-1,5-8-3.5-H_1x08_P3.50mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-3.5-H, 8 pins, pitch 3.5mm, size 28x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,

Pads: 8
THT: 29.0×8.6
Boards: 8

DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)

Pads: 9
SMD: 3.2×2.5
Boards: 7

QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)

Pads: 33
SMD: 6.3×6.3
Boards: 7

Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)

Pads: 25
SMD: 5.3×5.3
Boards: 7

WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)

Pads: 17
SMD: 4.3×4.3
Boards: 7

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

MSOP-8-1EP_3x3mm_P0.65mm_EP1.95x2.15mm

FP3D

Package_SO

MSOP, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf)

Pads: 9
SMD: 6.3×3.5
Boards: 7

WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias

FP3D

Package_SON

WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)

Pads: 11
SMD: 3.8×3.0
Boards: 7

WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias

FP3D

Package_SON

WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)

Pads: 11
SMD: 3.3×3.5
Boards: 7

TerminalBlock_Phoenix_MKDS-1,5-5-5.08_1x05_P5.08mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-5-5.08, 5 pins, pitch 5.08mm, size 25.4x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 5
THT: 26.4×10.8
Boards: 7