Footprints

377 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

377 footprints · page 6 of 16

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SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads: 48
SMD: 11.1×16.5
Boards: 8

DIP-4_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 4
SMD: 10.7×5.7
Boards: 7

DIP-48_W15.24mm_Socket_LongPads

FP3D

Package_DIP

48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads: 48
THT: 18.3×61.6
Boards: 7

DIP-6_W7.62mm_Socket_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 6
THT: 10.7×8.2
Boards: 7

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 21
SMD: 7.9×7.1
Boards: 7

TO-92-2

FP3D

Package_TO_SOT_THT

TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 2
THT: 5.5×4.7
Boards: 7

Fuse_BelFuse_0ZRE0016FF_L9.9mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0016FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 10.4×4.3
Boards: 6

Fuse_BelFuse_0ZRE0025FF_L9.6mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0025FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 10.1×4.3
Boards: 6

Fuse_BelFuse_0ZRE0033FF_L11.4mm_W3.8mm

FP3D

Fuse

Fuse 0ZRE0033FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf

Pads: 2
THT: 11.9×4.3
Boards: 6

Oscillator_SeikoEpson_SG-8002DC

FP3D

Oscillator

8-lead dip package, row spacing 7.62 mm (300 mils)

Pads: 4
THT: 9.8×14.0
Boards: 6

DIP-4_W7.62mm_Socket

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 4
THT: 10.7×5.7
Boards: 6

DIP-6_W10.16mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 6
THT: 12.3×8.1
Boards: 6

DIP-6_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 6
SMD: 10.7×8.2
Boards: 6

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 8
SMD: 12.5×10.8
Boards: 6

SMDIP-6_W9.53mm_Clearance8mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads: 6
SMD: 11.5×8.1
Boards: 6

SMDIP-8_W7.62mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads: 8
SMD: 10.1×10.7
Boards: 6

Diode_Bridge_Round_D8.9mm

FP3D

Diode_THT

4-lead round diode bridge package, diameter 8.9mm, pin pitch 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF

Pads: 4
THT: 8.4×9.3
Boards: 5

DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)

Pads: 13
SMD: 4.1×4.6
Boards: 5

DIP-14_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 14
SMD: 10.7×18.4
Boards: 5

DIP-16_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 16
SMD: 12.5×20.9
Boards: 5

DIP-64_W22.86mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils)

Pads: 64
THT: 25.0×81.8
Boards: 5

SO-4_4.4x2.3mm_P1.27mm

FP3D

Package_SO

4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf

Pads: 4
SMD: 8.8×2.9
Boards: 5

SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads: 56
SMD: 11.1×19.1
Boards: 5