Footprints

211 footprints matching “SOT”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

211 footprints · page 7 of 9

Matched by name and keywords. Search by meaning instead

SOT-666

FP3D

agg-agg

Pads: 6
SMD: 2.7×2.2
Boards: —

FCPBGA-780_23x23mm_Layout28x28_P0.8mm

FP3D

Package_BGA

FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf

Pads: 780
SMD: 25.0×25.0
Boards: —

NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm

FP3D

Package_BGA

NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf

Pads: 98
SMD: 9.0×9.0
Boards: —

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

FP3D

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Pads: 59
SMD: 6.0×6.0
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

TQFP-80_14x14mm_P0.65mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads: 80
SMD: 17.3×17.3
Boards: —