Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- 8
DIP-42_W15.24mm
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 42
- THT
- 17.3×53.9
- Boards
- 8
DIP-64_W22.86mm_Socket
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8
DIP-64_W22.86mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8
ST_HLGA-10_2.5x2.5mm_P0.6mm_LayoutBorder3x2y
Package_LGA
ST HLGA, 10 Pin (https://www.st.com/resource/en/datasheet/lps25hb.pdf#page=46)
- Pads
- 10
- SMD
- 3.0×3.0
- Boards
- 8
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
Texas_USON-6_1x1.45mm_P0.5mm_SMD
Package_SON
USON, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined
- Pads
- 6
- SMD
- 1.5×2.0
- Boards
- 8
DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
Package_DFN_QFN
DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/506AQ.PDF)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 7
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 7
Texas_RGE0024C_VQFN-24-1EP_4x4mm_P0.5mm_EP2.1x2.1mm
Package_DFN_QFN
Texas RGE0024C VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 7
WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_DFN_QFN
WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 7
DIP-4_W7.62mm_SMDSocket_SmallPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 4
- SMD
- 10.7×5.7
- Boards
- 7
DIP-48_W15.24mm_Socket_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads
- Pads
- 48
- THT
- 18.3×61.6
- Boards
- 7
DIP-6_W7.62mm_Socket_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 6
- THT
- 10.7×8.2
- Boards
- 7
LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lis2dh12.pdf)
- Pads
- 14
- SMD
- 2.2×2.2
- Boards
- 7
ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- 7
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 7
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 7
TO-92-2
Package_TO_SOT_THT
TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 2
- THT
- 5.5×4.7
- Boards
- 7
Fuse_BelFuse_0ZRE0016FF_L9.9mm_W3.8mm
Fuse
Fuse 0ZRE0016FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 10.4×4.3
- Boards
- 6
Fuse_BelFuse_0ZRE0025FF_L9.6mm_W3.8mm
Fuse
Fuse 0ZRE0025FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 10.1×4.3
- Boards
- 6
Fuse_BelFuse_0ZRE0033FF_L11.4mm_W3.8mm
Fuse
Fuse 0ZRE0033FF, BelFuse, Radial Leaded PTC,https://www.belfuse.com/resources/datasheets/circuitprotection/ds-cp-0zre-series.pdf
- Pads
- 2
- THT
- 11.9×4.3
- Boards
- 6
Oscillator_SeikoEpson_SG-8002DC
Oscillator
8-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 4
- THT
- 9.8×14.0
- Boards
- 6