Footprints
377 footprints matching “leaded”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
SSOP-18_4.4x6.5mm_P0.65mm
Package_SO
SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)
- Pads
- 18
- SMD
- 6.9×7.0
- Boards
- 3
Texas_S-PVSON-N8
Package_SON
8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf
- Pads
- 9
- SMD
- 4.2×3.6
- Boards
- 3
TO-92_Inline_W4.0mm_Horizontal_FlatSideDown
Package_TO_SOT_THT
TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)
- Pads
- 3
- THT
- 5.1×10.1
- Boards
- 3
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
DIP-14_W10.16mm_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 14
- THT
- 13.1×18.3
- Boards
- 2
DIP-14_W8.89mm_SMDSocket_LongPads
Package_DIP
14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 14
- SMD
- 12.5×18.4
- Boards
- 2
DIP-24_W10.16mm_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 24
- THT
- 13.1×31.0
- Boards
- 2
DIP-28_W7.62mm_SMDSocket_SmallPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 28
- SMD
- 10.7×36.2
- Boards
- 2
DIP-64_W22.86mm_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads
- Pads
- 64
- THT
- 25.8×81.8
- Boards
- 2
DIP-64_W25.4mm
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)
- Pads
- 64
- THT
- 27.5×81.8
- Boards
- 2
DIP-64_W25.4mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads
- Pads
- 64
- THT
- 28.4×81.9
- Boards
- 2
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
SMDIP-8_W11.48mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 8
- SMD
- 14.0×10.7
- Boards
- 2
SMDIP-8_W9.53mm_Clearance8mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 8
- SMD
- 11.5×10.7
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 2
SSO-6_6.8x4.6mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 6
- SMD
- 11.2×5.1
- Boards
- 2
SSOP-44_5.3x12.8mm_P0.5mm
Package_SO
44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf)
- Pads
- 44
- SMD
- 8.5×13.3
- Boards
- 2
TSSOP-44_4.4x11.2mm_P0.5mm
Package_SO
TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)
- Pads
- 44
- SMD
- 7.4×11.9
- Boards
- 2
Texas_S-PVSON-N8_ThermalVias
Package_SON
8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf
- Pads
- 9
- SMD
- 4.2×3.6
- Boards
- 2
WSON-14-1EP_4.0x4.0mm_P0.5mm_EP2.6x2.6mm
Package_SON
14-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf
- Pads
- 15
- SMD
- 4.9×4.5
- Boards
- 2
SW_Push_1P1T_NO_CK_KSC9xxJ
Button_Switch_SMD
Tactile switch, 6.2x6.2mm, H7.7mm, compatible with button, J leads, https://www.ckswitches.com/media/1975/ksc9.pdf
- Pads
- 2
- SMD
- 9.1×6.7
- Boards
- 1