Footprints
2,116 footprints matching “8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-48_W15.24mm_SMDSocket_SmallPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), SMDSocket, SmallPads
- Pads
- 48
- SMD
- 18.3×61.6
- Boards
- —
DIP-48_W16.51mm_SMDSocket_LongPads
Package_DIP
48-lead though-hole mounted DIP package, row spacing 16.51mm (650 mils), SMDSocket, LongPads
- Pads
- 48
- SMD
- 20.1×61.6
- Boards
- —
DIP-5-6_W8.89mm_SMDSocket_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads
- Pads
- 5
- SMD
- 12.5×8.3
- Boards
- —
DIP-64_W22.86mm_SMDSocket_SmallPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), SMDSocket, SmallPads
- Pads
- 64
- SMD
- 25.9×81.9
- Boards
- —
DIP-64_W26.67mm_SMDSocket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 26.67mm (1050 mils), SMDSocket, LongPads
- Pads
- 64
- SMD
- 30.3×81.9
- Boards
- —
DIP-8-N6_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- —
IXYS_Flatpak-8_6.3x9.7mm_P2.54mm
Package_DIP
IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)
- Pads
- 8
- SMD
- 10.8×10.2
- Boards
- —
IXYS_SMD-8_6.3x9.7mm_P2.54mm
Package_DIP
IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)
- Pads
- 8
- SMD
- 11.1×10.2
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
SMDIP-10_W11.48mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 10
- SMD
- 14.0×13.2
- Boards
- —
SMDIP-10_W9.53mm_Clearance8mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 10
- SMD
- 11.5×13.2
- Boards
- —
SMDIP-12_W11.48mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 12
- SMD
- 14.0×15.7
- Boards
- —
SMDIP-12_W9.53mm_Clearance8mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 12
- SMD
- 11.5×15.7
- Boards
- —
SMDIP-14_W11.48mm
Package_DIP
14-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 14
- SMD
- 14.0×18.3
- Boards
- —
SMDIP-14_W9.53mm_Clearance8mm
Package_DIP
14-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 14
- SMD
- 11.5×18.3
- Boards
- —
SMDIP-16_W11.48mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 16
- SMD
- 14.0×20.8
- Boards
- —
SMDIP-16_W9.53mm_Clearance8mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 16
- SMD
- 11.5×20.8
- Boards
- —
SMDIP-18_W11.48mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 18
- SMD
- 14.0×23.4
- Boards
- —
SMDIP-18_W7.62mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 18
- SMD
- 10.1×23.4
- Boards
- —
SMDIP-18_W9.53mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 18
- SMD
- 12.0×23.4
- Boards
- —
SMDIP-18_W9.53mm_Clearance8mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 18
- SMD
- 11.5×23.4
- Boards
- —
SMDIP-20_W11.48mm
Package_DIP
20-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 20
- SMD
- 14.0×25.9
- Boards
- —