Footprints
90 footprints matching “0.5A”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
R_Axial_DIN0309_L9.0mm_D3.2mm_P12.70mm_Horizontal
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=12.7mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 14.8×3.7
- Boards
- 230
Converter_DCDC_RECOM_R-78E-0.5_THT
Converter_DCDC
DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf
- Pads
- 3
- THT
- 12.1×9.0
- Boards
- 111
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
USON-10_2.5x1.0mm_P0.5mm
Package_SON
USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf
- Pads
- 10
- SMD
- 1.8×3.0
- Boards
- 84
R_Axial_DIN0309_L9.0mm_D3.2mm_P15.24mm_Horizontal
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=15.24mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 17.3×3.7
- Boards
- 64
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
R_Axial_DIN0309_L9.0mm_D3.2mm_P2.54mm_Vertical
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Vertical, pin pitch=2.54mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 5.4×3.7
- Boards
- 50
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
Hirose_FH12-24S-0.5SH_1x24-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 25
- SMD
- 18.1×7.9
- Boards
- 36
Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 7
- SMD
- 9.1×7.9
- Boards
- 31
Hirose_FH12-40S-0.5SH_1x40-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-40S-0.5SH, 40 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 41
- SMD
- 26.1×7.9
- Boards
- 29
Hirose_FH12-10S-0.5SH_1x10-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-10S-0.5SH, 10 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 11
- SMD
- 11.1×7.9
- Boards
- 25
Hirose_FH12-22S-0.5SH_1x22-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-22S-0.5SH, 22 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 23
- SMD
- 17.1×7.9
- Boards
- 25
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
Texas_S-PVSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 21
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
TestPoint_Bridge_Pitch2.0mm_Drill0.7mm
TestPoint
wire loop as test point, pitch 2.0mm, hole diameter 0.7mm, wire diameter 0.5mm
- Pads
- 1
- THT
- 4.4×2.4
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
Hirose_FH12-30S-0.5SH_1x30-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-30S-0.5SH, 30 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 31
- SMD
- 21.1×7.9
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
Hirose_FH12-20S-0.5SH_1x20-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-20S-0.5SH, 20 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 21
- SMD
- 16.1×7.9
- Boards
- 15
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 14
R_Axial_DIN0309_L9.0mm_D3.2mm_P5.08mm_Vertical
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Vertical, pin pitch=5.08mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 8.0×3.7
- Boards
- 14