Footprints
77 footprints matching “35mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
R_2512_6332Metric_Pad1.40x3.35mm_HandSolder
Resistor_SMD
Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 189
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
CP_Radial_D18.0mm_P7.50mm
Capacitor_THT
CP, Radial series, Radial, pin pitch=7.50mm, diameter=18mm, height=35mm, Electrolytic Capacitor
- Pads
- 2
- THT
- 18.5×18.5
- Boards
- 82
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
CP_Radial_D35.0mm_P10.00mm_SnapIn
Capacitor_THT
CP, Radial series, Radial, pin pitch=10.00mm, diameter=35mm, height=50mm, Electrolytic Capacitor, http://www.vishay.com/docs/28342/058059pll-si.pdf
- Pads
- 2
- THT
- 35.5×35.5
- Boards
- 12
LED_D3.0mm_Horizontal_O6.35mm_Z10.0mm
LED_THT
LED, diameter 3.0mm, horizontal offset 6.35mm, z-position of LED center 10.0mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.0×13.2
- Boards
- 11
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 8
SSOP-48_7.5x15.9mm_P0.635mm
Package_SO
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)
- Pads
- 48
- SMD
- 11.1×16.5
- Boards
- 8
LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y
Package_LGA
LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lis2dh12.pdf)
- Pads
- 14
- SMD
- 2.2×2.2
- Boards
- 7
X2SON-8_1.4x1mm_P0.35mm
Package_SON
X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf
- Pads
- 8
- SMD
- 1.7×1.9
- Boards
- 7
DSUB-15-HD_Socket_Horizontal_P2.29x2.54mm_EdgePinOffset8.35mm_Housed_MountingHolesOffset10.89mm
Connector_Dsub
15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x2.54mm, pin-PCB-offset 8.35mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 10.89mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf
- Pads
- 16
- THT
- 31.9×22.6
- Boards
- 5
L_2512_6332Metric_Pad1.52x3.35mm_HandSolder
Inductor_SMD
Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 8.0×3.9
- Boards
- 5
LED_D5.0mm_Horizontal_O6.35mm_Z15.0mm
LED_THT
LED, diameter 5.0mm, horizontal offset 6.35mm, z-position of LED center 15.0mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 6.4×16.5
- Boards
- 5
PQFP-132_24x24mm_P0.635mm_i386
Package_QFP
PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)
- Pads
- 132
- SMD
- 28.9×28.9
- Boards
- 5
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5