Footprints

95 footprints matching “56

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

95 footprints · page 1 of 4

Matched by name and keywords. Search by meaning instead

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads
57
SMD
8.3×8.3
Boards
381

SOT-563

FP3D

Package_TO_SOT_SMD

SOT, 6 Pin (https://www.jedec.org/system/files/docs/MO-293B.pdf)

Pads
6
SMD
2.4×1.9
Boards
160

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads
8
SMD
9.3×5.8
Boards
139

Fuseholder_Blade_Mini_Keystone_3568

FP3D

Fuse

fuse holder, car blade fuse mini, http://www.keyelco.com/product-pdf.cfm?p=306

Pads
2
THT
16.5×7.2
Boards
57

QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)

Pads
57
SMD
8.3×8.3
Boards
34

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads
44
SMD
13.3×13.3
Boards
27

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads
57
SMD
8.2×8.2
Boards
24

CA56-12EWA

FP3D

Display_7Segment

4 digit 7 segment green LED, http://www.kingbrightusa.com/images/catalog/SPEC/CA56-12EWA.pdf

Pads
12
THT
19.5×50.8
Boards
23

BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
16.0×16.0
Boards
23

LFPAK56

FP3D

Package_TO_SOT_SMD

LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf

Pads
5
SMD
7.3×5.5
Boards
22

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads
57
SMD
8.3×8.3
Boards
21

Fuseholder_TR5_Littelfuse_No560_No460

FP3D

Fuse

Fuse, Fuseholder, TR5, Littelfuse/Wickmann, No. 460, No560, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_holders/littelfuse_fuse_holder_559_560_datasheet.pdf.pdf

Pads
2
THT
10.0×10.0
Boards
19

HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm

FP3D

Package_SO

HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf

Pads
57
SMD
9.6×14.6
Boards
16

C_2225_5664Metric_Pad1.80x6.60mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads
2
SMD
7.6×7.1
Boards
10

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads
5
SMD
7.3×5.8
Boards
9

CA56-12SRWA

FP3D

Display_7Segment

4 digit 7 segment green LED, http://www.kingbrightusa.com/images/catalog/SPEC/CA56-12SRWA.pdf

Pads
12
THT
19.5×50.8
Boards
8

CA56-12CGKWA

FP3D

Display_7Segment

4 digit 7 segment green LED, http://www.kingbright.com/attachments/file/psearch/000/00/00/CA56-12CGKWA(Ver.9A).pdf

Pads
12
THT
19.5×50.8
Boards
7

DA56-11SURKWA

FP3D

Display_7Segment

http://www.kingbright.com/attachments/file/psearch/000/00/00/DA56-11SURKWA(Ver.11A).pdf

Pads
18
THT
19.6×25.5
Boards
6

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
19.0×19.0
Boards
5

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads
57
SMD
8.2×8.2
Boards
5

SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads
56
SMD
11.1×19.1
Boards
5

CA56-12SURKWA

FP3D

Display_7Segment

4 digit 7 segment green LED, http://www.kingbright.com/attachments/file/psearch/000/00/00/CA56-12SURKWA(Ver.8A).pdf

Pads
12
THT
19.5×50.8
Boards
4

C_2225_5664Metric

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads
2
SMD
7.2×7.1
Boards
3

DA56-11CGKWA

FP3D

Display_7Segment

http://www.kingbright.com/attachments/file/psearch/000/00/00/DA56-11CGKWA(Ver.16A).pdf

Pads
18
THT
19.6×25.5
Boards
3