Footprints

64 footprints matching “6.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

64 footprints · page 1 of 3

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TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
20
SMD
7.7×7.0
Boards
731

Buzzer_TDK_PS1240P02BT_D12.2mm_H6.5mm

FP3D

Buzzer_Beeper

Buzzer, D12.2mm height 6.5mm, https://product.tdk.com/info/en/catalog/datasheets/piezoelectronic_buzzer_ps_en.pdf

Pads
2
THT
12.7×12.7
Boards
79

Pin_D0.7mm_L6.5mm_W1.8mm_FlatFork

FP3D

Connector_Pin

solder Pin_ with flat fork, hole diameter 0.7mm, length 6.5mm, width 1.8mm

Pads
1
THT
2.8×2.4
Boards
48

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads
20
SMD
7.8×7.0
Boards
39

Crystal_C26-LF_D2.1mm_L6.5mm_Horizontal

FP3D

Crystal

C26-LF, Crystal, length 6.5mm, width 2.1mm, THT

Pads
2
THT
3.6×10.0
Boards
30

CP_Axial_L18.0mm_D6.5mm_P25.00mm_Horizontal

FP3D

Capacitor_THT

CP, Axial series, Axial, Horizontal, pin pitch=25mm, length*diameter=18*6.5mm^2, Electrolytic Capacitor, http://www.vishay.com/docs/28325/021asm.pdf

Pads
2
THT
27.9×7.0
Boards
24

C_Axial_L12.0mm_D6.5mm_P20.00mm_Horizontal

FP3D

Capacitor_THT

C, Axial series, Axial, Horizontal, pin pitch=20mm, length*diameter=12*6.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf

Pads
2
THT
22.1×7.0
Boards
15

C_Rect_L16.5mm_W6.0mm_P15.00mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*6mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
17.7×6.5
Boards
13

C_Rect_L7.5mm_W6.5mm_P5.00mm

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=5.00mm, length*width=7.5*6.5mm^2, Capacitor

Pads
2
THT
8.0×7.0
Boards
13

C_Rect_L26.5mm_W10.5mm_P22.50mm_MKS4

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=22.50mm, length*width=26.5*10.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf

Pads
2
THT
27.0×11.0
Boards
12

C_Axial_L12.0mm_D6.5mm_P15.00mm_Horizontal

FP3D

Capacitor_THT

C, Axial series, Axial, Horizontal, pin pitch=15mm, length*diameter=12*6.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf

Pads
2
THT
17.1×7.0
Boards
8

ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
21
SMD
7.9×7.1
Boards
7

C_Rect_L16.5mm_W4.7mm_P15.00mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*4.7mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
17.7×5.2
Boards
6

Crystal_C26-LF_D2.1mm_L6.5mm_Vertical

FP3D

Crystal

C26-LF, Crystal, length 6.5mm, width 2.06mm

Pads
2
THT
3.4×3.1
Boards
6

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads
21
SMD
7.8×7.0
Boards
6

C_Rect_L16.5mm_W5.0mm_P15.00mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*5mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
17.7×5.5
Boards
5

C_Rect_L16.5mm_W7.0mm_P15.00mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*7mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
17.7×7.5
Boards
4

C_Axial_L17.0mm_D6.5mm_P20.00mm_Horizontal

FP3D

Capacitor_THT

C, Axial series, Axial, Horizontal, pin pitch=20mm, length*diameter=17*6.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf

Pads
2
THT
22.1×7.0
Boards
3

C_Rect_L26.5mm_W11.5mm_P22.50mm_MKS4

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=22.50mm, length*width=26.5*11.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf

Pads
2
THT
27.0×12.0
Boards
3

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads
65
SMD
13.3×13.3
Boards
3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads
18
SMD
6.9×7.0
Boards
3

C_Rect_L16.5mm_W8.7mm_P15.00mm_MKT

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=15.00mm, length*width=16.5*8.7mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf

Pads
2
THT
17.7×9.2
Boards
2

C_Rect_L26.5mm_W6.0mm_P22.50mm_MKS4

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=22.50mm, length*width=26.5*6mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf

Pads
2
THT
27.0×6.5
Boards
2

C_Rect_L7.0mm_W6.5mm_P5.00mm

FP3D

Capacitor_THT

C, Rect series, Radial, pin pitch=5.00mm, length*width=7*6.5mm^2, Capacitor

Pads
2
THT
7.5×7.0
Boards
2