Footprints

51 footprints matching “66

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

51 footprints · page 1 of 3

Matched by name and keywords. Search by meaning instead

SOT-666

FP3D

Package_TO_SOT_SMD

SOT666

Pads
6
SMD
3.0×2.2
Boards
194

Potentiometer_Bourns_3266Y_Vertical

FP3D

Potentiometer_THT

Potentiometer, vertical, Bourns 3266Y, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads
3
THT
7.2×5.0
Boards
52

SSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)

Pads
20
SMD
7.8×7.0
Boards
39

Potentiometer_Bourns_3266W_Vertical

FP3D

Potentiometer_THT

Potentiometer, vertical, Bourns 3266W, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads
3
THT
7.2×5.0
Boards
38

ESP-WROOM-02

FP3D

RF_Module

https://www.espressif.com/sites/default/files/documentation/0c-esp-wroom-02_datasheet_en.pdf

Pads
19
SMD
28.5×25.5
Boards
26

DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm

FP3D

Package_DFN_QFN

DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)

Pads
9
SMD
4.0×3.6
Boards
23

LFPAK56

FP3D

Package_TO_SOT_SMD

LFPAK56 https://assets.nexperia.com/documents/outline-drawing/SOT669.pdf

Pads
5
SMD
7.3×5.5
Boards
22

WEMOS_D1_mini_light

FP3D

RF_Module

16-pin module, column spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg

Pads
16
THT
26.1×34.7
Boards
14

C_2225_5664Metric_Pad1.80x6.60mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads
2
SMD
7.6×7.1
Boards
10

BatteryHolder_Keystone_2466_1xAAA

FP3D

Battery

1xAAA Battery Holder, Keystone, Plastic Case, http://www.keyelco.com/product-pdf.cfm?p=1031

Pads
2
THT
51.0×14.0
Boards
9

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads
5
SMD
7.3×5.8
Boards
9

Potentiometer_Bourns_3266P_Horizontal

FP3D

Potentiometer_THT

Potentiometer, horizontal, Bourns 3266P, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads
3
THT
8.7×7.2
Boards
6

C_2225_5664Metric

FP3D

Capacitor_SMD

Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf)

Pads
2
SMD
7.2×7.1
Boards
3

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads
17
SMD
7.8×5.5
Boards
3

SOT-665

FP3D

Package_TO_SOT_SMD

SOT665

Pads
5
SMD
2.9×2.2
Boards
3

Potentiometer_Bourns_3266X_Horizontal

FP3D

Potentiometer_THT

Potentiometer, horizontal, Bourns 3266X, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads
3
THT
8.7×5.0
Boards
2

SW_DIP_SPSTx12_Slide_9.78x32.66mm_W7.62mm_P2.54mm

FP3D

Button_Switch_THT

12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. https://www.ctscorp.com/wp-content/uploads/206-208.pdf)

Pads
24
THT
10.3×33.3
Boards
1

DFN-12-1EP_4x4mm_P0.5mm_EP2.66x3.38mm

FP3D

Package_DFN_QFN

DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf)

Pads
13
SMD
5.0×4.6
Boards
1

Potentiometer_Bourns_3266Z_Horizontal

FP3D

Potentiometer_THT

Potentiometer, horizontal, Bourns 3266Z, https://www.bourns.com/docs/Product-Datasheets/3266.pdf

Pads
3
THT
8.7×5.0
Boards
1

R_Axial_Power_L60.0mm_W14.0mm_P66.04mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=66.04mm, 25W, length*width*height=60*14*14mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
69.0×14.5
Boards
1

SOT-666

FP3D

agg-agg

Pads
6
SMD
2.7×2.2
Boards

SW_DIP_SPSTx12_Slide_9.78x32.66mm_W8.61mm_P2.54mm

FP3D

Button_Switch_SMD

SMD 12x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD

Pads
24
SMD
11.6×33.3
Boards

PhoenixContact_SPT_1.5_5-H-3.5_1x05_P3.5mm_Horizontal

FP3D

Connector_Phoenix_SPT

Connector Phoenix Contact, SPT 1.5/5-H-3.5 Terminal Block, 1990766 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990766)

Pads
5
THT
19.9×15.4
Boards

PhoenixContact_SPT_2.5_1-H-5.0_1x01_P5.0mm_Horizontal

FP3D

Connector_Phoenix_SPT

Connector Phoenix Contact, SPT 2.5/1-H-5.0 Terminal Block, 1751066 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1751066)

Pads
1
THT
7.4×15.4
Boards