Footprints
336 footprints matching “POWER”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
PowerIntegrations_SMD-8
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 8
- SMD
- 11.1×10.7
- Boards
- 3
PowerIntegrations_SO-8C
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- 3
PowerIntegrations_SMD-8B
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- 2
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm_ThermalVias
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- 1
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
PowerIntegrations_eSIP-7C
Package_SIP
eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 6
- THT
- 10.5×5.8
- Boards
- —
PowerIntegrations_eSIP-7F
Package_SIP
eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf
- Pads
- 6
- THT
- 14.0×10.7
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- —
BarrelJack_Horizontal
Connector_BarrelJack
DC Barrel Jack
- Pads
- 3
- THT
- 16.0×11.5
- Boards
- 635
BarrelJack_CUI_PJ-063AH_Horizontal
Connector_BarrelJack
Barrel Jack, 2.0mm ID, 5.5mm OD, 24V, 8A, no switch, https://www.cui.com/product/resource/pj-063ah.pdf
- Pads
- 3
- THT
- 12.0×14.0
- Boards
- 90
D_PowerDI-123
Diode_SMD
http://www.diodes.com/_files/datasheets/ds30497.pdf
- Pads
- 2
- SMD
- 5.0×2.6
- Boards
- 78
TDSON-8-1
Package_TO_SOT_SMD
Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/)
- Pads
- 5
- SMD
- 7.2×5.7
- Boards
- 70
L_Bourns_SRN6045TA
Inductor_SMD
http://www.bourns.com/docs/product-datasheets/srn6045ta.pdf
- Pads
- 2
- SMD
- 7.0×6.5
- Boards
- 63
USB_C_Receptacle_GCT_USB4125-xx-x_6P_TopMnt_Horizontal
Connector_USB
USB Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A, 1mm stake: https://gct.co/files/drawings/usb4125.pdf
- Pads
- 7
- SMD
- 10.7×8.3
- Boards
- 41
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
L_Murata_DFE201610P
Inductor_SMD
Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)
- Pads
- 2
- SMD
- 2.5×2.1
- Boards
- 32