Footprints
89 footprints matching “Plastic”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
SO-4_4.4x3.6mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339
- Pads
- 4
- SMD
- 8.8×4.1
- Boards
- 49
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
SO-4_4.4x4.3mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN
- Pads
- 4
- SMD
- 7.7×4.8
- Boards
- 24
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
DFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm
Package_DFN_QFN
DD Package; 14-Lead Plastic DFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF)
- Pads
- 15
- SMD
- 4.0×3.6
- Boards
- 14
PowerIntegrations_SO-8
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf
- Pads
- 8
- SMD
- 8.0×5.4
- Boards
- 13
SSO-8_6.8x5.9mm_P1.27mm_Clearance8mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 13.1×6.4
- Boards
- 13
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11