Footprints
198 footprints matching “SOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOP-4_4.4x2.6mm_P1.27mm
Package_SO
SOP, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf)
- Pads
- 4
- SMD
- 8.5×3.1
- Boards
- 48
SOP-16_4.4x10.4mm_P1.27mm
Package_SO
SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)
- Pads
- 16
- SMD
- 8.5×10.9
- Boards
- 45
SOP-4_3.8x4.1mm_P2.54mm
Package_SO
SOP, 4 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc1017n-datasheet?assetguid=b4f177f1-629f-4104-97a5-8b8d709e83de)
- Pads
- 4
- SMD
- 7.5×4.6
- Boards
- 34
SOP-28_8.4x18.16mm_P1.27mm
Package_SO
SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)
- Pads
- 28
- SMD
- 13.9×18.7
- Boards
- 8
SOP-8_6.605x9.655mm_P2.54mm
Package_SO
SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)
- Pads
- 8
- SMD
- 11.5×10.2
- Boards
- 3
SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-012, variation AC, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 1,078
TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×7.0
- Boards
- 731
SOT-363_SC-70-6
Package_TO_SOT_SMD
SOT, 6 Pin (https://home.jeita.or.jp/tsc/std-pdf/ED-7500A.pdf#page=170, JEDEC MO-203, variant AB, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203)
- Pads
- 6
- SMD
- 2.9×2.2
- Boards
- 586
TSSOP-16_4.4x5mm_P0.65mm
Package_SO
TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 16
- SMD
- 7.7×5.5
- Boards
- 579
TSSOP-14_4.4x5mm_P0.65mm
Package_SO
TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 14
- SMD
- 7.7×5.5
- Boards
- 507
MSOP-8_3x3mm_P0.65mm
Package_SO
MSOP, 8 Pin (https://www.jedec.org/system/files/docs/mo-187F.pdf variant AA)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 348
MSOP-10_3x3mm_P0.5mm
Package_SO
MSOP, 10 Pin (JEDEC MO-187 variation BA, 0.85mm body thickness, https://www.jedec.org/system/files/docs/mo-187F.pdf)
- Pads
- 10
- SMD
- 6.2×3.5
- Boards
- 333
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
TSSOP-8_4.4x3mm_P0.65mm
Package_SO
TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 8
- SMD
- 7.7×3.5
- Boards
- 179
TSSOP-28_4.4x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 7.7×10.2
- Boards
- 164
VSSOP-8_2.3x2mm_P0.5mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 4.6×2.5
- Boards
- 156
TSSOP-10_3x3mm_P0.5mm
Package_SO
TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)
- Pads
- 10
- SMD
- 6.3×3.5
- Boards
- 153
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
TSSOP-8_3x3mm_P0.65mm
Package_SO
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)
- Pads
- 8
- SMD
- 5.9×3.6
- Boards
- 111
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
SSOP-20_5.3x7.2mm_P0.65mm
Package_SO
SSOP, 20 Pin (JEDEC MO-150 variation AE, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=396)
- Pads
- 20
- SMD
- 9.4×7.7
- Boards
- 77
TSOP-6_1.65x3.05mm_P0.95mm
Package_SO
TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 6
- SMD
- 3.5×3.5
- Boards
- 69