Footprints
6 footprints matching “Toshiba”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Toshiba_11-7A9
Package_DIP
Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)
- Pads
- 5
- THT
- 9.8×8.2
- Boards
- —
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSSOP-16_4.4x5mm_P0.65mm
Package_SO
TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 16
- SMD
- 7.7×5.5
- Boards
- 579
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
SO-5-6_4.55x3.7mm_P1.27mm
Package_SO
SO, 5 Pin (https://toshiba.semicon-storage.com/us/semiconductor/design-development/package/detail.5pin%20SO6.html)
- Pads
- 5
- SMD
- 8.0×4.2
- Boards
- 6