Footprints
58 footprints matching “flat”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
LED_D3.0mm_FlatTop
LED_THT
LED, Round, Flat Top, diameter 3.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/00/L-47XEC(Ver.14A).pdf, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 4.8×4.4
- Boards
- 64
DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 55
Pin_D0.7mm_L6.5mm_W1.8mm_FlatFork
Connector_Pin
solder Pin_ with flat fork, hole diameter 0.7mm, length 6.5mm, width 1.8mm
- Pads
- 1
- THT
- 2.8×2.4
- Boards
- 48
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
L_Murata_DFE201610P
Inductor_SMD
Inductor, Murata, DFE201610P, 2.0x1.6x1.0mm, (https://www.murata.com/~/media/webrenewal/products/inductor/chip/tokoproducts/wirewoundmetalalloychiptype/m_dfe201610p.ashx)
- Pads
- 2
- SMD
- 2.5×2.1
- Boards
- 32
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
LED_D5.0mm_FlatTop
LED_THT
LED, Round, Flat Top, diameter 5.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/watermark00/L-483GDT(Ver.12B).pdf, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 6.5×6.5
- Boards
- 25
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
Pin_D0.9mm_L10.0mm_W2.4mm_FlatFork
Connector_Pin
solder Pin_ with flat fork, hole diameter 0.9mm, length 10.0mm, width 2.4mm
- Pads
- 1
- THT
- 3.4×2.8
- Boards
- 17
LED_D2.0mm_W4.8mm_H2.5mm_FlatTop
LED_THT
LED, Round, Flat Top, Rectangular, size 4.8x2.5mm, diameter 2.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/20160808bak/L-13GD(Ver.9B).pdf, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.4×3.1
- Boards
- 17
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
TO-92Flat
Package_TO_SOT_THT
TO-92Flat package, often used for hall sensors, drill 0.75mm (see e.g. http://www.ti.com/lit/ds/symlink/drv5023.pdf)
- Pads
- 3
- THT
- 4.5×2.1
- Boards
- 12
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
Pin_D1.4mm_L8.5mm_W2.8mm_FlatFork
Connector_Pin
solder Pin_ with flat with fork, hole diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434
- Pads
- 1
- THT
- 3.8×3.6
- Boards
- 10
L_Wuerth_HCI-1040
Inductor_SMD
Inductor, Wuerth, HCI-1040, 10.2x10.2x4.0mm, (https://www.we-online.com/components/products/datasheet/744355215.pdf)
- Pads
- 2
- SMD
- 12.0×10.7
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
Pin_D1.1mm_L8.5mm_W2.5mm_FlatFork
Connector_Pin
solder Pin_ with flat fork, hole diameter 1.1mm, length 8.5mm, width 2.5mm
- Pads
- 1
- THT
- 3.5×3.2
- Boards
- 8
L_Wuerth_HCI-1365
Inductor_SMD
Inductor, Wuerth, HCI-1365, 12.8x12.8x6.2mm, (https://www.we-online.com/components/products/datasheet/744355122.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 8
LED_D2.0mm_W4.0mm_H2.8mm_FlatTop
LED_THT
LED, Round, Flat Top, Rectangular, size 4.0x2.8mm, diameter 2.0mm, 2 pins, https://www.kingbright.com/attachments/file/psearch/000/00/00/L-1034IDT(Ver.14A).pdf, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 4.8×3.4
- Boards
- 7
L_Wuerth_HCI-5040
Inductor_SMD
Inductor, Wuerth, HCI-5040, 5.5x5.3x4.0mm, (https://www.we-online.com/components/products/datasheet/744316022.pdf)
- Pads
- 2
- SMD
- 6.5×5.8
- Boards
- 5
L_Wuerth_HCI-1350
Inductor_SMD
Inductor, Wuerth, HCI-1350, 12.8x12.8x4.7mm, (https://www.we-online.com/components/products/datasheet/744355019.pdf)
- Pads
- 2
- SMD
- 15.5×13.3
- Boards
- 4