Footprints

171 footprints matching “thermal”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

171 footprints · page 1 of 8

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WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 60

Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias

FP3D

Package_SO

8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf

Pads: 9
SMD: 8.4×5.5
Boards: 47

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 28

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 24

QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 21

Texas_S-PVSON-N10_ThermalVias

FP3D

Package_SON

3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf

Pads: 11
SMD: 4.3×4.3
Boards: 21

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)

Pads: 25
SMD: 5.3×5.3
Boards: 20

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 17

QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)

Pads: 41
SMD: 6.2×6.2
Boards: 15

TO-277A

FP3D

Package_TO_SOT_SMD

Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf

Pads: 3
SMD: 5.3×7.3
Boards: 15

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 14

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm

FP3D

Package_SON

VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument

Pads: 11
SMD: 4.3×4.3
Boards: 14

Texas_S-PDSO-N12

FP3D

Package_SON

http://www.ti.com/lit/ds/symlink/bq27441-g1.pdf

Pads: 13
SMD: 4.9×3.4
Boards: 13

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 12

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 11

PQFN-8-EP_6x5mm_P1.27mm_Generic

FP3D

Package_DFN_QFN

Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf

Pads: 5
SMD: 7.3×5.8
Boards: 9