Footprints
39 footprints matching “x8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-14_3.9x8.7mm_P1.27mm
Package_SO
SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 908
SO-14_3.9x8.65mm_P1.27mm
Package_SO
SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 147
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
SW_Tactile_SPST_Angled_PTS645Vx83-2LFS
Button_Switch_THT
tactile switch SPST right angle, PTS645VL83-2 LFS
- Pads
- 2
- THT
- 9.6×7.3
- Boards
- 69
SSOP-20_3.9x8.7mm_P0.635mm
Package_SO
SSOP20: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf)
- Pads
- 20
- SMD
- 6.9×9.3
- Boards
- 54
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
QSOP-24_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 24
- SMD
- 7.4×9.2
- Boards
- 10
TFBGA-100_8x8mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 8.0x8.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=199
- Pads
- 100
- SMD
- 10.0×10.0
- Boards
- 8
R_LDR_10x8.5mm_P7.6mm_Vertical
OptoDevice
Resistor, LDR 10x8.5mm
- Pads
- 2
- THT
- 10.9×9.0
- Boards
- 7
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm
Package_DFN_QFN
QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- 5
TSOP-I-32_11.8x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 32
- SMD
- 14.9×8.5
- Boards
- 4
TSOP-I-32_12.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)
- Pads
- 32
- SMD
- 15.5×8.5
- Boards
- 4
QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm_ThermalVias
Package_DFN_QFN
QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- 3
QSOP-20_3.9x8.7mm_P0.635mm
Package_SO
QSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 20
- SMD
- 7.4×9.2
- Boards
- 3
TSOP-I-32_14.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB)
- Pads
- 32
- SMD
- 17.5×8.5
- Boards
- 3
TSOP-I-32_18.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD)
- Pads
- 32
- SMD
- 21.5×8.5
- Boards
- 3
QFN-56-1EP_8x8mm_P0.5mm_EP4.5x5.2mm
Package_DFN_QFN
QFN, 56 Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4)
- Pads
- 57
- SMD
- 9.3×9.3
- Boards
- 2
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 2
Stocko_MKS_1658-6-0-808_1x8_P2.50mm_Vertical
Connector_Stocko
Stocko MKS 16xx series connector, (https://www.stocko-contact.com/downloads/steckverbindersystem-raster-2,5-mm.pdf#page=15)
- Pads
- 8
- THT
- 25.7×8.5
- Boards
- 1
QFN-64-1EP_8x8mm_P0.4mm_EP6.5x6.5mm_ThermalVias
Package_DFN_QFN
QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf)
- Pads
- 65
- SMD
- 9.2×9.2
- Boards
- 1
LFPAK88
Package_TO_SOT_SMD
LFPAK88 PowerPAK 8 x 8L BWL Single SOT-1235 (https://assets.nexperia.com/documents/package-information/SOT1235.pdf)
- Pads
- 5
- SMD
- 9.3×9.1
- Boards
- 1
SW_Push_1P1T_NO_CK_PTS125Sx85PSMTR
Button_Switch_SMD
Tactile switch, 12x12 mm, H8.5 mm, round actuator, with pegs, gullwing terminals, https://www.ckswitches.com/media/1462/pts125.pdf
- Pads
- 2
- SMD
- 16.8×12.5
- Boards
- —
SW_Push_1P1T_NO_CK_PTS125Sx85SMTR
Button_Switch_SMD
Tactile switch, 12x12 mm, H8.5 mm, round actuator, gullwing terminals, https://www.ckswitches.com/media/1462/pts125.pdf
- Pads
- 2
- SMD
- 16.8×12.5
- Boards
- —