Footprints

674 footprints matching “solder”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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674 footprints · page 10 of 29

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R_4020_10251Metric_Pad1.65x5.30mm_HandSolder

FP3D

Resistor_SMD

Resistor SMD 4020 (10251 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://datasheet.octopart.com/HVC0603T5004FET-Ohmite-datasheet-26699797.pdf)

Pads: 2
SMD: 12.0×5.8
Boards: 4

R_Array_Concave_2x0603

FP3D

Resistor_SMD

Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf)

Pads: 4
SMD: 3.1×2.1
Boards: 4

ublox_SAM-M8Q_HandSolder

FP—

RF_GPS

GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf

Pads: 20
SMD: 17.9×17.9
Boards: 4

CP_EIA-3528-12_Kemet-T_HandSolder

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-T (3528-12 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 5.3×3.3
Boards: 3

Pin_D1.3mm_L11.3mm_W2.8mm_Flat

FP3D

Connector_Pin

solder Pin_ with flat with hole, hole diameter 1.3mm, length 11.3mm, width 2.8mm

Pads: 1
THT: 3.8×3.6
Boards: 3

SolderWire-0.15sqmm_1x03_P4mm_D0.5mm_OD1.5mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 0.15 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.15 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 3
THT: 11.0×2.7
Boards: 3

SolderWire-0.25sqmm_1x01_D0.65mm_OD2mm

FP—

Connector_Wire

Soldered wire connection, for a single 0.25 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 2mm, size source Multi-Contact FLEXI-2V 0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 3.5×3.0
Boards: 3

SolderWire-0.25sqmm_1x04_P4.2mm_D0.65mm_OD1.7mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 4
THT: 15.8×13.2
Boards: 3

SolderWire-0.5sqmm_1x01_D0.9mm_OD2.3mm_Relief

FP—

Connector_Wire

Soldered wire connection with feed through strain relief, for a single 0.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter

Pads: 1
THT: 3.8×17.4
Boards: 3

SolderWire-1.5sqmm_1x03_P6mm_D1.7mm_OD3mm

FP—

Connector_Wire

Soldered wire connection, for 3 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 3
THT: 16.5×4.2
Boards: 3

SolderWire-1.5sqmm_1x04_P6mm_D1.7mm_OD3mm

FP—

Connector_Wire

Soldered wire connection, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 4
THT: 22.5×4.2
Boards: 3

SolderWirePad_1x01_SMD_1.5x3mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 1.5mm x 3mm

Pads: 1
SMD: 2.0×3.5
Boards: 3

Crystal_SMD_7050-2Pin_7.0x5.0mm_HandSoldering

FP—

Crystal

SMD7050/4, Crystal, 7.0x5.0mm package, SMD, hand-soldering, https://www.foxonline.com/pdfs/FQ7050.pdf

Pads: 2
SMD: 12.7×6.0
Boards: 3

D_MELF_Handsoldering

FP3D

Diode_SMD

Diode MELF Handsoldering

Pads: 2
SMD: 10.8×3.2
Boards: 3

D_SC-80_HandSoldering

FP3D

Diode_SMD

JEITA SC-80

Pads: 2
SMD: 3.8×1.4
Boards: 3

L_2010_5025Metric_Pad1.52x2.65mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 6.7×3.2
Boards: 3

L_Wuerth_WE-PD-Typ-LS_Handsoldering

FP—

Inductor_SMD

Shielded Power Inductor, Wuerth Elektronik, WE-PD, SMD, Typ LS, Handsoldering, https://katalog.we-online.com/pbs/datasheet/7447715906.pdf

Pads: 2
SMD: 17.5×13.0
Boards: 3

LED_LiteOn_LTST-E563C_PLCC4_5.0x5.0mm_P3.2mm_HandSoldering

FP—

LED_SMD

RGB addressable LED, 5x5mm body, 1.57mm height, https://optoelectronics.liteon.com/upload/download/DS35-2018-0092/LTST-E563CHEGBW-AW.PDF

Pads: 4
SMD: 7.1×5.5
Boards: 3

Oscillator_SMD_EuroQuartz_XO53-4Pin_5.0x3.2mm_HandSoldering

FP3D

Oscillator

EuroQuartz XO53, Miniature Crystal Clock Oscillator, 5.0x3.2mm package, SMD, hand-soldering, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf

Pads: 4
SMD: 6.0×5.1
Boards: 3

Oscillator_SMD_SeikoEpson_SG8002LB-4Pin_5.0x3.2mm_HandSoldering

FP—

Oscillator

Seiko Epson SG-8002LB, Crystal Oscillator, 5.0x3.2mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC

Pads: 4
SMD: 6.0×5.7
Boards: 3

CP_EIA-3216-18_Kemet-A_HandSolder

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 5.0×2.1
Boards: 2