Footprints
2,819 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-10_W7.62mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 10
- THT
- 9.7×13.2
- Boards
- 9
DIP-4_W10.16mm
Package_DIP
4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 4
- THT
- 12.3×5.6
- Boards
- 9
Infineon_PG-TSNP-6-10_0.7x1.1mm_0.7x1.1mm_P0.4mm
Package_LGA
6 lead, 1.1x0.7mm body, 0.37mm height, TSNP (https://www.infineon.com/cms/en/product/packages/PG-TSNP/PG-TSNP-6-10/)
- Pads
- 6
- SMD
- 1.2×1.6
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
Diodes_PSOP-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3mm_ThermalVias
Package_SO
16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 9
HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm_ThermalVias
Package_SO
HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)
- Pads
- 33
- SMD
- 9.0×11.6
- Boards
- 9
TSOP-II-32_21.0x10.2mm_P1.27mm
Package_SO
32-lead plastic TSOP; Type II
- Pads
- 32
- SMD
- 13.4×21.0
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ds/symlink/tps62177.pdf)
- Pads
- 11
- SMD
- 3.3×3.5
- Boards
- 9
Allegro_QFN-12-10-1EP_3x3mm_P0.5mm
Sensor_Current
Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)
- Pads
- 10
- SMD
- 4.2×4.3
- Boards
- 9
LFCSP-24-1EP_4x4mm_P0.5mm_EP2.3x2.3mm
Package_CSP
LFCSP, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-24/cp_24_14.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 8
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm_ThermalVias
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 8
DFN-6-1EP_3x2mm_P0.5mm_EP1.65x1.35mm
Package_DFN_QFN
DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf)
- Pads
- 7
- SMD
- 4.2×2.5
- Boards
- 8
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.3mm
Package_DFN_QFN
DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 8
QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=276)
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- 8
QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias
Package_DFN_QFN
QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 8
Texas_RHA0040B_VQFN-40-1EP_6x6mm_P0.5mm_EP4.15x4.15mm_ThermalVias
Package_DFN_QFN
Texas RHA0040B VQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=72 JEDEC MO-220 variation VJJD-2)
- Pads
- 41
- SMD
- 7.3×7.3
- Boards
- 8
Texas_X2QFN-12_1.6x1.6mm_P0.4mm
Package_DFN_QFN
Texas X2QFN, 12 Pin (http://www.ti.com/lit/ml/mpqf391c/mpqf391c.pdf)
- Pads
- 12
- SMD
- 2.8×2.8
- Boards
- 8
VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm
Package_DFN_QFN
VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 8
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- 8
DIP-42_W15.24mm
Package_DIP
42-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 42
- THT
- 17.3×53.9
- Boards
- 8
DIP-64_W22.86mm_Socket
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8
DIP-64_W22.86mm_Socket_LongPads
Package_DIP
64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), Socket, LongPads
- Pads
- 64
- THT
- 25.9×81.9
- Boards
- 8