Footprints
448 footprints matching “pd”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_CommonMode_Toroid_Vertical_L22.0mm_W12.0mm_Px9.00mm_Py8.00mm_PRODTech_PDMCAT18107-502ML
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=9.00*8.00mm^2, length*width=22*12mm^2, PRODTech, PDMCAT18107-502ML, https://www.lcsc.com/datasheet/C2831472.pdf
- Pads
- 4
- THT
- 22.5×12.5
- Boards
- —
USB_C_Receptacle_HRO_TYPE-C-31-M-12
kiml-00-kiml-connector-usb
USB Type-C receptacle for USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf
- Pads
- 17
- THT
- 10.6×9.4
- Boards
- —
SW_Push_2P2T_Toggle_8x8mm
kiml-00-kiml-switch-button-tht
momentary / push-push button
- Pads
- 6
- THT
- 10.3×9.7
- Boards
- —
LED_Kingbright_APDA3020VBCD
LED_SMD
LED, SMD, APDA3020VBC/D, https://www.kingbrightusa.com/images/catalog/SPEC/APDA3020VBC-D.pdf
- Pads
- 2
- SMD
- 5.5×3.5
- Boards
- —
Texas_EUS_R-PDSS-T5_THT
Module
Texas Instruments EUS 5 Pin Double Sided Module
- Pads
- 5
- THT
- 19.9×13.6
- Boards
- —
SMD-DIP-8_W9.53mm
muratovas-MAS_Package_nostd
8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils)
- Pads
- 8
- SMD
- 12.1×10.7
- Boards
- —
SW_Slide_SK-12D02-G040
muratovas-MAS_Package_std
CuK miniature slide switch, OS series, SPDT, https://datasheet.lcsc.com/lcsc/2201121500_G-Switch-SK-12D02-G040_C2930976.pdf
- Pads
- 3
- THT
- 10.9×4.8
- Boards
- —
Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm
muratovas-MAS_Package_std
HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- —
USB_C_Receptacle_HRO_TYPE-C-31-M-12
muratovas-MAS_Package_std
USB Type-C receptacle for USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf
- Pads
- 17
- SMD
- 10.6×9.4
- Boards
- —
Broadcom_APDS-9160-003
OptoDevice
Broadcom DFN, 8 Pin (https://docs.broadcom.com/docs/APDS-9160-003-DS)
- Pads
- 8
- SMD
- 3.1×2.6
- Boards
- —
Broadcom_APDS-9301
OptoDevice
ambient light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN
- Pads
- 6
- SMD
- 3.1×3.8
- Boards
- —
Oscillator_SeikoEpson_SG-8002DB
Oscillator
14-lead dip package, row spacing 7.62 mm (300 mils)
- Pads
- 4
- THT
- 9.8×20.4
- Boards
- —
DIP-10_W10.16mm
Package_DIP
10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 10
- THT
- 12.3×13.2
- Boards
- —
DIP-10_W7.62mm_SMDSocket_SmallPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 10
- SMD
- 10.7×13.3
- Boards
- —
DIP-10_W7.62mm_Socket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 10
- THT
- 10.7×13.3
- Boards
- —
DIP-10_W8.89mm_SMDSocket_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 10
- SMD
- 12.5×13.3
- Boards
- —
DIP-18_W7.62mm_SMDSocket_SmallPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 18
- SMD
- 10.7×23.5
- Boards
- —
DIP-18_W8.89mm_SMDSocket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 18
- SMD
- 12.5×23.5
- Boards
- —
DIP-20_W7.62mm_SMDSocket_SmallPads
Package_DIP
20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 20
- SMD
- 10.7×26.0
- Boards
- —
DIP-22_W10.16mm_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 22
- THT
- 13.1×28.4
- Boards
- —
DIP-22_W10.16mm_SMDSocket_SmallPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads
- Pads
- 22
- SMD
- 13.2×28.6
- Boards
- —
DIP-22_W10.16mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads
- Pads
- 22
- THT
- 13.2×28.6
- Boards
- —
DIP-22_W11.43mm_SMDSocket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 11.43mm (450 mils), SMDSocket, LongPads
- Pads
- 22
- SMD
- 15.0×28.6
- Boards
- —
DIP-22_W7.62mm
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 22
- THT
- 9.7×28.4
- Boards
- —