Footprints
1,347 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Molex_SlimStack_54722-0164_2x08_P0.50mm_Vertical
Connector_Molex
Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0164, 16 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf)
- Pads
- 16
- SMD
- 7.6×7.6
- Boards
- 3
SolderWire-0.15sqmm_1x03_P4mm_D0.5mm_OD1.5mm
Connector_Wire
Soldered wire connection, for 3 times 0.15 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.15 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 3
- THT
- 11.0×2.7
- Boards
- 3
SolderWire-0.5sqmm_1x01_D0.9mm_OD2.3mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for a single 0.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 3.8×17.4
- Boards
- 3
Converter_DCDC_RECOM_R-78HB-0.5L_THT
Converter_DCDC
DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf
- Pads
- 3
- THT
- 12.0×20.6
- Boards
- 3
Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 2.9×3.9
- Boards
- 3
Texas_DSBGA-8_1.43x1.41mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 8
- SMD
- 3.4×3.4
- Boards
- 3
Texas_DSBGA-9_1.4715x1.4715mm_Layout3x3_P0.5mm
Package_BGA
Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)
- Pads
- 9
- SMD
- 3.5×3.5
- Boards
- 3
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 3
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm_ThermalVias
Package_CSP
LFCSP, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 3
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.25x3.25mm
Package_CSP
32-Lead Frame Chip Scale Package LFCSP (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf
- Pads
- 33
- SMD
- 6.0×6.0
- Boards
- 3
DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 13
- SMD
- 4.3×3.6
- Boards
- 3
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)
- Pads
- 9
- SMD
- 3.3×2.5
- Boards
- 3
HVQFN-16-1EP_3x3mm_P0.5mm_EP1.5x1.5mm
Package_DFN_QFN
HVQFN, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT758-1.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 3
HVQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias
Package_DFN_QFN
http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf
- Pads
- 9
- SMD
- 2.7×2.5
- Boards
- 3
MLF-6-1EP_1.6x1.6mm_P0.5mm_EP0.5x1.26mm
Package_DFN_QFN
MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf)
- Pads
- 7
- SMD
- 2.8×2.1
- Boards
- 3
QFN-12-1EP_3x3mm_P0.51mm_EP1.45x1.45mm
Package_DFN_QFN
QFN, 12 Pin (https://ww2.minicircuits.com/case_style/DQ1225.pdf)
- Pads
- 13
- SMD
- 4.3×4.3
- Boards
- 3
QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf)
- Pads
- 21
- SMD
- 4.8×4.8
- Boards
- 3
QFN-20-1EP_3x4mm_P0.5mm_EP1.65x2.65mm
Package_DFN_QFN
QFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)
- Pads
- 21
- SMD
- 4.3×5.3
- Boards
- 3
QFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 3
QFN-24-1EP_4x4mm_P0.5mm_EP2.15x2.15mm
Package_DFN_QFN
QFN, 24 Pin (https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=34)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
QFN-24-1EP_4x4mm_P0.5mm_EP2.65x2.65mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://www.cypress.com/file/46236/download)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
QFN-24-1EP_4x4mm_P0.5mm_EP2.75x2.75mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.infineon.com/dgdl/Infineon-EZ-PD_BCR_Datasheet_USB_Type-C_Port_Controller_for_Power_Sinks-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ce9d70ad)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.6mm
Package_DFN_QFN
QFN, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 3