Footprints

497 footprints matching “SOP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

497 footprints · page 16 of 21

Matched by name and keywords. Search by meaning instead

SOP-4_4.4x2.6mm_P1.27mm

FP—

jlcpcb-JLCPCB

SOP, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 4
SMD: 8.5×3.1
Boards: —

TSSOP-10_3x3mm_P0.5mm

FP—

jlcpcb-JLCPCB

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf)

Pads: 10
SMD: 5.9×3.6
Boards: —

TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL

FP—

jlcpcb-JLCPCB

TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL footprint

Pads: 16
SMD: 7.7×5.5
Boards: —

TSSOP-20_4.4x6.5mm_P0.65mm

FP—

jlcpcb-JLCPCB

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 20
SMD: 7.7×7.0
Boards: —

TSSOP-24_L7.8-W4.4-P0.65-LS6.4-BL

FP—

jlcpcb-JLCPCB

TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 24
SMD: 9.4×8.3
Boards: —

SOP-4_3.8x4.1mm_P2.54mm

FP—

jlcpcb-JLCPCB-Kicad-Footprints

SOP, 4 Pin (http://www.ixysic.com/home/pdfs.nsf/www/CPC1017N.pdf/$file/CPC1017N.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads: 4
SMD: 7.4×4.6
Boards: —

Fairchild_LSOP-8

FP—

Package_DIP

8-lead, 300 mils wide, surface mount package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf)

Pads: 8
SMD: 11.2×10.2
Boards: —

Analog_MSOP-12-16_3x4.039mm_P0.5mm

FP3D

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)

Pads: 12
SMD: 5.6×4.5
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 21
SMD: 15.9×18.2
Boards: —

HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugUp

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 1.27mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 20
SMD: 15.9×16.4
Boards: —

HSOP-32-1EP_7.5x11mm_P0.65mm_EP4.7x4.7mm

FP—

Package_SO

HSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT1746-3.pdf)

Pads: 33
SMD: 11.6×11.5
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 37
SMD: 15.9×18.2
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias

FP—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 37
SMD: 15.9×16.6
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp

FP3D

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 36
SMD: 15.9×16.4
Boards: —

HSOP-54-1EP_7.5x17.9mm_P0.65mm_EP4.6x4.6mm

FP—

Package_SO

HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf)

Pads: 55
SMD: 11.6×18.4
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads: 21
SMD: 7.9×7.1
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)

Pads: 21
SMD: 7.8×7.0
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias

FP—

Package_SO

Pads: 25
SMD: 7.8×8.3
Boards: —

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm

FP—

Package_SO

HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 25
SMD: 7.8×8.3
Boards: —