Footprints

574 footprints matching “sot”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

574 footprints · page 16 of 24

Matched by name and keywords. Search by meaning instead

FCPBGA-780_23x23mm_Layout28x28_P0.8mm

FP3D

Package_BGA

FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf

Pads: 780
SMD: 25.0×25.0
Boards: —

NXP_SOT1982-1_VFBGA-98_7x7mm_Layout13x13_P0.5mm

FP3D

Package_BGA

NXP VFBGA-98 (Case SOT1982-1), 0.28mm pad, 7x7mm, 98 Ball, 13x13 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1982-1.pdf

Pads: 98
SMD: 9.0×9.0
Boards: —

NXP_SOT2162-1_VFBGA-59_4x4mm_Layout9x9_P0.4mm

FP3D

Package_BGA

NXP VFBGA-59 (Case SOT2162-1), 0.24mm pad, 4x4mm, 59 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT2162-1.pdf

Pads: 59
SMD: 6.0×6.0
Boards: —

NXP_TFBGA-50_5x5mm_Layout9x9_P0.5mm

FP—

Package_BGA

TFBGA-50, 5.0x5.0mm, 50 Ball, 9x9 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1345-1.pdf

Pads: 50
SMD: 7.0×7.0
Boards: —

NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm

FP3D

Package_CSP

NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf

Pads: 49
SMD: 5.4×5.4
Boards: —

NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm

FP3D

Package_CSP

NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf

Pads: 100
SMD: 7.1×7.1
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

HVQFN-36-1EP_6x6mm_P0.5mm_EP3.9x3.9mm_ThermalVias

FP3D

Package_DFN_QFN

HVQFN, 36 Pin (https://www.nxp.com.cn/docs/en/package-information/SOT1092-2.pdf)

Pads: 37
SMD: 7.3×7.3
Boards: —

NXP_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm

FP—

Package_DFN_QFN

NXP VQFN, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT629-1.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias

FP—

Package_DFN_QFN

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.1x4.96mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.5x5.06mm

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21_DD_SC.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

VQFN-56-1EP_8x8mm_P0.5mm_EP5.5x5.06mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 56 Pin (https://www.nxp.com/docs/en/package-information/SOT684-21_DD_SC.pdf)

Pads: 57
SMD: 9.2×9.2
Boards: —

NXP_USON-8_1x1.35mm_P0.35mm

FP—

Package_LGA

NXP USON, 8 Pin (https://www.nxp.com/docs/en/package-information/SOT1203.pdf)

Pads: 8
SMD: 1.7×1.9
Boards: —

LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm

FP—

Package_QFP

LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)

Pads: 101
SMD: 17.3×17.3
Boards: —

LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm_ThermalVias

FP—

Package_QFP

Pads: 101
SMD: 17.3×17.3
Boards: —

TQFP-80_14x14mm_P0.65mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads: 80
SMD: 17.3×17.3
Boards: —