Footprints
434 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HSOP-54-1EP_7.5x17.9mm_P0.65mm_EP4.6x4.6mm
Package_SO
HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf)
- Pads
- 55
- SMD
- 11.6×18.4
- Boards
- —
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.96x2.96mm
Package_SO
HTSSOP, 20 Pin (https://www.ti.com/lit/ds/symlink/tps2663.pdf#page=49)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)
- Pads
- 29
- SMD
- 8.0×10.3
- Boards
- —
SSOP-8_5.3x3mm_P0.65mm
Package_SO
SSOP, 8 Pin (JEDEC MO-150 variation AA, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)
- Pads
- 8
- SMD
- 9.4×3.5
- Boards
- —
Texas_DAD0032A_HTSSOP-32_6.1x11mm_P0.65mm_TopEP3.71x3.81mm
Package_SO
Texas DAD0032A HTSSOP, 32 Pin (https://www.ti.com/lit/ds/symlink/tpa3116d2.pdf)
- Pads
- 32
- SMD
- 9.5×11.5
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008B_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x3mm_Mask1.88x1.98mm_ThermalVias
Package_SO
Texas DGN0008B VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tps7a4101.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —
Texas_DGN0008D_VSSOP-8-1EP_3x3mm_P0.65mm_EP2x2.94mm_Mask1.57x1.89mm
Package_SO
Texas DGN0008D VSSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa711.pdf)
- Pads
- 9
- SMD
- 6.4×3.5
- Boards
- —