Footprints
422 footprints matching “0.8mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Xilinx_CSGA324
Package_BGA
Spartan-7 BGA, NSMD pad definition Appendix A, 15x15mm, 324 Ball, 18x18 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- —
Xilinx_RS484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_SBG484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_SBG485
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Package_CSP
Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf
- Pads
- 15
- SMD
- 4.4×3.2
- Boards
- —
Xilinx_CSG48_7.0x7.0mm_Layout7x7_P0.8mm
Package_CSP
XC9572XL CS BGA, 7x7mm, 48 Ball, 7x7 Layout, 0.8mm Pitch, https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/cs48.pdf
- Pads
- 48
- SMD
- 9.0×9.0
- Boards
- —
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
Texas_RTE_WQFN-16-1EP_3x3mm_P0.5mm_EP1.2x0.8mm_ThermalVias
Package_DFN_QFN
Texas RTE WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
Texas_RTE0016D_WQFN-16-1EP_3x3mm_P0.5mm_EP0.8x0.8mm
Package_DFN_QFN
Texas RTE0016D WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/dac80504.pdf#page=47)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
Texas_RTE0016D_WQFN-16-1EP_3x3mm_P0.5mm_EP0.8x0.8mm_ThermalVias
Package_DFN_QFN
Texas RTE0016D WQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/dac80504.pdf#page=47)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
TQFN-16-1EP_5x5mm_P0.8mm_EP2.29x2.29mm
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-4))
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
TQFN-16-1EP_5x5mm_P0.8mm_EP2.29x2.29mm_ThermalVias
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-4))
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
TQFN-16-1EP_5x5mm_P0.8mm_EP3.1x3.1mm
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-2))
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
TQFN-16-1EP_5x5mm_P0.8mm_EP3.1x3.1mm_ThermalVias
Package_DFN_QFN
TQFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-2))
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
Hitachi_FP80B_PQFP-80_14x20mm_P0.8mm
Package_QFP
Hitachi FP80B PQFP, 80 Pin (Hitachi FP-80B, 2.70mm body thickness, https://www.icbase.com/pdf/HTH/HTH14270106.pdf#page=9, https://bitsavers.trailing-edge.com/components/hitachi/_dataBooks/1994_M24T026_Hitachi_LCD_Controller_Driver_LSI_Data_Book.pdf#page=28)
- Pads
- 80
- SMD
- 20.4×26.4
- Boards
- —
LQFP-64_14x14mm_P0.8mm
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT791-1.pdf)
- Pads
- 64
- SMD
- 17.4×17.4
- Boards
- —
Microchip_PQFP-44_10x10mm_P0.8mm
Package_QFP
Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)
- Pads
- 44
- SMD
- 15.4×15.4
- Boards
- —
PQFP-128_28x28mm_P0.8mm
Package_QFP
PQFP, 128 Pin (JEITA/EIAJ ED-7311A (variation 128-001-KD) / JEDEC MS-022 (variation DB-2), 3.40mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=78, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 128
- SMD
- 32.5×32.5
- Boards
- —
PQFP-64_14x14mm_P0.8mm
Package_QFP
PQFP, 64 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-qfp-64pin-prqp0064gb)
- Pads
- 64
- SMD
- 18.7×18.7
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
SSOP-40_8.8x17.5mm_P0.8mm
Package_SO
SSOP, 40 Pin (JEITA/EIAJ ED-7311-20 variation 40-001-GABB, 2.40mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311-20/#target/page_no=114)
- Pads
- 40
- SMD
- 13.3×18.0
- Boards
- —
ST_PowerSSO-24_SlugDown
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —