Footprints
1,509 footprints matching “2mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SolderWire-0.25sqmm_1x04_P4.2mm_D0.65mm_OD1.7mm_Relief
Connector_Wire
Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 4
- THT
- 15.8×13.2
- Boards
- 3
Fuse_SunFuse-6HP
Fuse
SunFuse Ceramic Slow Blow Fuse 6H_6HP.PDF
- Pads
- 2
- THT
- 40.0×7.5
- Boards
- 3
L_Axial_L12.0mm_D5.0mm_P15.24mm_Horizontal_Fastron_MISC
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=15.24mm, length*diameter=12*5mm^2, Fastron, MISC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_MISC.pdf
- Pads
- 2
- THT
- 18.1×5.5
- Boards
- 3
L_Axial_L12.0mm_D5.0mm_P5.08mm_Vertical_Fastron_MISC
Inductor_THT
Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=12*5mm^2, Fastron, MISC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_MISC.pdf
- Pads
- 2
- THT
- 9.3×5.5
- Boards
- 3
L_Toroid_Vertical_L17.8mm_W8.1mm_P7.62mm_Bourns_5700
Inductor_THT
L_Toroid, Vertical series, Radial, pin pitch=7.62mm, length*width=17.8*8.1mm^2, Bourns, 5700, http://www.bourns.com/docs/Product-Datasheets/5700_series.pdf
- Pads
- 2
- THT
- 18.3×9.9
- Boards
- 3
L_Toroid_Vertical_L22.4mm_W10.2mm_P7.90mm_Vishay_TJ4
Inductor_THT
L_Toroid, Vertical series, Radial, pin pitch=7.90mm, length*width=22.4*10.2mm^2, Vishay, TJ4, http://www.vishay.com/docs/34079/tj.pdf
- Pads
- 2
- THT
- 22.9×11.4
- Boards
- 3
LED_LiteOn_LTST-E563C_PLCC4_5.0x5.0mm_P3.2mm_HandSoldering
LED_SMD
RGB addressable LED, 5x5mm body, 1.57mm height, https://optoelectronics.liteon.com/upload/download/DS35-2018-0092/LTST-E563CHEGBW-AW.PDF
- Pads
- 4
- SMD
- 7.1×5.5
- Boards
- 3
MountingHole_4.3x6.2mm_M4_Pad
MountingHole
Mounting Hole 4.3x6.2mm, M4
- Pads
- 1
- THT
- 11.0×9.1
- Boards
- 3
MountingHole_4.3x6.2mm_M4_Pad_Via
MountingHole
Mounting Hole 4.3x6.2mm, M4
- Pads
- 1
- THT
- 11.0×9.1
- Boards
- 3
Oscillator_SMD_EuroQuartz_XO53-4Pin_5.0x3.2mm_HandSoldering
Oscillator
EuroQuartz XO53, Miniature Crystal Clock Oscillator, 5.0x3.2mm package, SMD, hand-soldering, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf
- Pads
- 4
- SMD
- 6.0×5.1
- Boards
- 3
Oscillator_SMD_Fordahl_DFAS15-4Pin_5.0x3.2mm
Oscillator
Fordahl DFA S15-OV/UOV, Ultraminiature Crystal Clock Oscillator TXCO, 5.0x3.2mm package, SMD, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf
- Pads
- 4
- SMD
- 6.1×4.5
- Boards
- 3
Oscillator_SMD_IDT_JS6-6_5.0x3.2mm_P1.27mm
Oscillator
SMD Crystal Oscillator IDT https://www.idt.com/document/dst/xu-family-datasheet#page=15, 5.0x3.2mm
- Pads
- 6
- SMD
- 4.0×5.5
- Boards
- 3
Oscillator_SMD_SeikoEpson_SG8002LB-4Pin_5.0x3.2mm_HandSoldering
Oscillator
Seiko Epson SG-8002LB, Crystal Oscillator, 5.0x3.2mm package, SMD, hand-soldering, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC
- Pads
- 4
- SMD
- 6.0×5.7
- Boards
- 3
DFN-6_1.3x1.2mm_P0.4mm
Package_DFN_QFN
6-Lead Plastic DFN (1.3mm x 1.2mm)
- Pads
- 6
- SMD
- 1.6×1.4
- Boards
- 3
DFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16)
- Pads
- 9
- SMD
- 3.3×2.5
- Boards
- 3
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.8x1.3mm_ThermalVias
Package_DFN_QFN
http://ww1.microchip.com/downloads/en/DeviceDoc/mic2290.pdf
- Pads
- 9
- SMD
- 2.7×2.5
- Boards
- 3
QFN-20-1EP_3.5x3.5mm_P0.5mm_EP2x2mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf)
- Pads
- 21
- SMD
- 4.8×4.8
- Boards
- 3
QFN-24-1EP_5x5mm_P0.65mm_EP3.2x3.2mm
Package_DFN_QFN
QFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UH24)%20QFN%2005-08-1747%20Rev%20A.pdf)
- Pads
- 25
- SMD
- 6.3×6.3
- Boards
- 3
QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm_ThermalVias
Package_DFN_QFN
QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- 3
Texas_RWU0007A_VQFN-7_2x2mm_P0.5mm
Package_DFN_QFN
Texas RWU0007A VQFN, 2x2mm, 7 Pin (https://www.ti.com/lit/ds/symlink/tps61022.pdf)
- Pads
- 7
- SMD
- 2.9×2.5
- Boards
- 3
WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 3
CERDIP-16_W7.62mm_SideBrazed_LongPads
Package_DIP
16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 16
- THT
- 10.5×20.8
- Boards
- 3
CERDIP-28_W7.62mm_SideBrazed_LongPads_Socket
Package_DIP
28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 3
CERDIP-8_W7.62mm_SideBrazed_Socket
Package_DIP
8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf
- Pads
- 8
- THT
- 10.7×13.8
- Boards
- 3