Footprints
435 footprints matching “3.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Molex_Micro-Fit_3.0_43045-0412_2x02_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43045-0412 (compatible alternatives: 43045-0413, 43045-0424), 2 Pins per row (http://www.molex.com/pdm_docs/sd/430450212_sd.pdf), generated with kicad-footprint-generator
- Pads
- 4
- THT
- 10.6×9.8
- Boards
- —
Molex_Micro-Fit_3.0_43045-0600_2x03_P3.00mm_Horizontal
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43045-0600 (alternative finishes: 43045-060x), 3 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator
- Pads
- 6
- THT
- 14.2×13.7
- Boards
- —
Molex_Micro-Fit_3.0_43045-0612_2x03_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43045-0612 (compatible alternatives: 43045-0613, 43045-0624), 3 Pins per row (http://www.molex.com/pdm_docs/sd/430450212_sd.pdf), generated with kicad-footprint-generator
- Pads
- 6
- THT
- 13.6×9.8
- Boards
- —
Molex_Micro-Fit_3.0_43045-0800_2x04_P3.00mm_Horizontal
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43045-0800 (alternative finishes: 43045-080x), 4 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator
- Pads
- 8
- THT
- 17.2×13.7
- Boards
- —
Molex_Micro-Fit_3.0_43045-0812_2x04_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43045-0812 (compatible alternatives: 43045-0813, 43045-0824), 4 Pins per row (http://www.molex.com/pdm_docs/sd/430450212_sd.pdf), generated with kicad-footprint-generator
- Pads
- 8
- THT
- 16.6×9.8
- Boards
- —
Molex_Micro-Fit_3.0_43650-0200_1x02_P3.00mm_Horizontal
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43650-0200 (compatible alternatives: 43650-0201, 43650-0202), 2 Pins per row (https://www.molex.com/pdm_docs/sd/436500300_sd.pdf), generated with kicad-footprint-generator
- Pads
- 2
- THT
- 10.6×10.9
- Boards
- —
Molex_Micro-Fit_3.0_43650-0215_1x02_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43650-0215 (compatible alternatives: 43650-0216, 43650-0217), 2 Pins per row (http://www.molex.com/pdm_docs/sd/436500215_sd.pdf), generated with kicad-footprint-generator
- Pads
- 2
- THT
- 10.6×6.8
- Boards
- —
Molex_Micro-Fit_3.0_43650-0300_1x03_P3.00mm_Horizontal
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43650-0300 (compatible alternatives: 43650-0301, 43650-0302), 3 Pins per row (https://www.molex.com/pdm_docs/sd/436500300_sd.pdf), generated with kicad-footprint-generator
- Pads
- 3
- THT
- 13.6×10.9
- Boards
- —
Molex_Micro-Fit_3.0_43650-0315_1x03_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43650-0315 (compatible alternatives: 43650-0316, 43650-0317), 3 Pins per row (http://www.molex.com/pdm_docs/sd/436500215_sd.pdf), generated with kicad-footprint-generator
- Pads
- 3
- THT
- 13.6×6.8
- Boards
- —
Molex_Micro-Fit_3.0_43650-0415_1x04_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System, 43650-0415 (compatible alternatives: 43650-0416, 43650-0417), 4 Pins per row (http://www.molex.com/pdm_docs/sd/436500215_sd.pdf), generated with kicad-footprint-generator
- Pads
- 4
- THT
- 16.7×6.8
- Boards
- —
Molex_Micro-Fit_3.0_44769-0401_2x02_P3.00mm_Vertical
muratovas-MAS_Package_std
Molex Micro-Fit 3.0 Connector System
- Pads
- 4
- THT
- 12.5×9.0
- Boards
- —
BGA-1023_33.0x33.0mm_Layout32x32_P1.0mm
Package_BGA
BGA-1023
- Pads
- 1023
- SMD
- 35.0×35.0
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Fujitsu_WLP-15_2.28x3.092mm_Layout3x5_P0.4mm
Package_BGA
WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf
- Pads
- 8
- SMD
- 4.3×5.1
- Boards
- —
TFBGA-49_3x3mm_Layout7x7_P0.4mm
Package_BGA
TFBGA-49, NSMD, 3.0x3.0mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf
- Pads
- 49
- SMD
- 5.0×5.0
- Boards
- —
ST_WLCSP-36_2.58x3.07mm_Layout6x6_P0.4mm
Package_CSP
ST WLCSP-36, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf
- Pads
- 36
- SMD
- 4.6×5.1
- Boards
- —
ST_WLCSP-52_3.09x3.15mm_Layout13x8_P0.4mm_Stagger
Package_CSP
ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136
- Pads
- 52
- SMD
- 5.1×5.2
- Boards
- —
DFN-14-1EP_3x4.5mm_P0.65mm_EP1.65x4.25mm_ThermalVias
Package_DFN_QFN
14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf)
- Pads
- 15
- SMD
- 4.4×5.0
- Boards
- —
Texas_RGY_R-PVQFN-N20_EP2.05x3.05mm_ThermalVias
Package_DFN_QFN
QFN, 20 Pin, RGY0020A (https://www.ti.com/lit/ds/symlink/txb0108.pdf#page=33)
- Pads
- 21
- SMD
- 4.4×5.4
- Boards
- —
Texas_S-PWQFN-N20
Package_DFN_QFN
20-Pin Plastic Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf)
- Pads
- 20
- SMD
- 3.9×3.9
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm
Package_SO
TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- —
