Footprints

1,141 footprints matching “0.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,141 footprints · page 2 of 48

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QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)

Pads: 33
SMD: 6.3×6.3
Boards: 72

Fiducial_0.5mm_Mask1.5mm

FP—

Fiducial

Fiducial, circular marking, 0.5mm bare copper, 1.5mm soldermask opening

Pads: —
SMD: 2.0×2.0
Boards: 70

LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y

FP3D

Package_LGA

LGA, 16 Pin (https://www.st.com/resource/en/datasheet/lis331dlh.pdf)

Pads: 16
SMD: 3.5×3.5
Boards: 61

Bosch_LGA-14_3x2.5mm_P0.5mm

FP3D

Package_LGA

LGA-14 Bosch https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMI160-DS000-07.pdf

Pads: 14
SMD: 3.7×3.2
Boards: 60

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 64
SMD: 13.3×13.3
Boards: 58

LGA-28_5.2x3.8mm_P0.5mm

FP3D

Package_LGA

LGA 28 5.2x3.8mm Pitch 0.5mm

Pads: 28
SMD: 6.0×4.5
Boards: 56

QFN-48-1EP_7x7mm_P0.5mm_EP5.3x5.3mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62)

Pads: 49
SMD: 8.2×8.2
Boards: 53

TQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

TQFP, 144 Pin (JEDEC MS-026 variation AFB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 144
SMD: 23.3×23.3
Boards: 52

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 51

DFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.5mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/AT24C64D-I%C2%B2C-Compatible-(2-Wire)-Serial-EEPROM-64-Kbit-(8,192x8)-20005937C.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 47

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Sensirion_DFN-8-1EP_2.5x2.5mm_P0.5mm_EP1.1x1.7mm

FP—

Sensor_Humidity

Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf)

Pads: 9
SMD: 3.4×3.0
Boards: 46

Texas_DRC0010J_ThermalVias

FP—

Package_SON

Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf

Pads: 11
SMD: 3.9×3.9
Boards: 45

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 44

SolderWire-0.5sqmm_1x02_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 8.2×3.2
Boards: 41