Footprints
443 footprints matching “0.65”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
D_SOD-882
Diode_SMD
SOD-882, DFN1006-2, body 1.0 x 0.6 x 0.48mm, pitch 0.65mm, https://assets.nexperia.com/documents/package-information/SOD882.pdf
- Pads
- 2
- SMD
- 1.6×1.2
- Boards
- 26
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
Texas_X2SON-4_1x1mm_P0.65mm
Package_SON
X2SON 5 pin 1x1mm package, DQN0004A (Reference Datasheet: http://www.ti.com/lit/ds/sbvs193d/sbvs193d.pdf Reference part: TPS383x) [StepUp generated footprint]
- Pads
- 5
- SMD
- 1.8×1.5
- Boards
- 22
PQFP-100_14x20mm_P0.65mm
Package_QFP
PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 100
- SMD
- 18.5×24.5
- Boards
- 18
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
SSOP-16_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14)
- Pads
- 16
- SMD
- 9.1×6.7
- Boards
- 15
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14
Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias
Package_LGA
Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)
- Pads
- 9
- SMD
- 3.3×3.5
- Boards
- 14
MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm
Package_SO
MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 14
SSOP-14_5.3x6.2mm_P0.65mm
Package_SO
SSOP, 14 Pin (JEDEC MO-150 variation AB, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150)
- Pads
- 14
- SMD
- 9.4×6.7
- Boards
- 14
PQFP-160_28x28mm_P0.65mm
Package_QFP
PQFP, 160 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 160
- SMD
- 32.5×32.5
- Boards
- 13
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm_ThermalVias
Package_SO
HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- 13
VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm
Package_SON
VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 13
UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
Package_DFN_QFN
UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf
- Pads
- 5
- SMD
- 1.8×1.5
- Boards
- 12
LED_SK6812_EC15_1.5x1.5mm
LED_SMD
RGB addressable LED, 0.1W, 1.5mm x 1.5mm, 0.65m height, orientation mark at GND, http://ledstrip-china.com/productshow.asp?id=322
- Pads
- 4
- SMD
- 2.0×2.0
- Boards
- 11
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm
Package_SO
16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 10
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm
Package_SO
HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- 10
SolderWire-0.25sqmm_1x01_D0.65mm_OD1.7mm
Connector_Wire
Soldered wire connection, for a single 0.25 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter
- Pads
- 1
- THT
- 3.2×2.8
- Boards
- 9
DFN-6-1EP_2x2mm_P0.65mm_EP1.01x1.7mm
Package_DFN_QFN
DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2020-6%20(Type%20C).pdf)
- Pads
- 7
- SMD
- 3.2×2.5
- Boards
- 9
DFN-8-1EP_3x3mm_P0.65mm_EP1.7x2.05mm
Package_DFN_QFN
DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf)
- Pads
- 9
- SMD
- 4.2×3.5
- Boards
- 9
Texas_RGV0016A_VQFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_DFN_QFN
Texas RGV0016A VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 9
Texas_RGW0020A_VQFN-20-1EP_5x5mm_P0.65mm_EP3.15x3.15mm_ThermalVias
Package_DFN_QFN
Texas RGW0020A VQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps7a47.pdf#page=29)
- Pads
- 21
- SMD
- 6.3×6.3
- Boards
- 9