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Footprints

33 footprints matching “26mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints on their own, whether or not a symbol uses them.

33 footprints · page 2 of 2

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Heatsink_35x26mm_1xFixation3mm_Fischer-SK486-35

FP—

Heatsink

Heatsink, 35mm x 26mm, 1x Fixation 3mm, Fischer SK486-35

Pads
1
THT
35.5×26.5
Boards
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L_Axial_L26.0mm_D10.0mm_P5.08mm_Vertical_Fastron_77A

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=26*10mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf

Pads
2
THT
11.8×10.5
Boards
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L_Axial_L26.0mm_D11.0mm_P7.62mm_Vertical_Fastron_77A

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, length*diameter=26*11mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf

Pads
2
THT
14.8×11.5
Boards
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L_Axial_L26.0mm_D9.0mm_P30.48mm_Horizontal_Fastron_77A

FP3D

Inductor_THT

Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf

Pads
2
THT
33.4×9.5
Boards
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L_Axial_L26.0mm_D9.0mm_P7.62mm_Vertical_Fastron_77A

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf

Pads
2
THT
13.8×9.5
Boards
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L_Toroid_Horizontal_D26.0mm_P5.08mm

FP—

Inductor_THT

inductor 26mm diameter toroid

Pads
2
THT
27.3×30.7
Boards
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L_Toroid_Horizontal_D40.0mm_P48.26mm

FP—

Inductor_THT

L_Toroid, Horizontal series, Radial, pin pitch=48.26mm, diameter=40mm, height=4mm

Pads
2
THT
51.8×40.5
Boards
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OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads
8
SMD
5.2×5.2
Boards
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OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssembly

FP—

Package_CSP

OnSemi ODCSP8 (Case 570CS), 0.46mm pad, manual assembly variant (larger pads), 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF

Pads
8
SMD
5.2×5.2
Boards
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