Footprints

310 footprints matching “8-pin”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

310 footprints · page 2 of 13

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HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 28

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 28

Molex_KK-254_AE-6410-08A_1x08_P2.54mm_Vertical

FP3D

Connector_Molex

Molex KK-254 Interconnect System, old/engineering part number: AE-6410-08A example for new part number: 22-27-2081, 8 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf)

Pads: 8
THT: 21.3×6.8
Boards: 26

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm

FP3D

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 25

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 20

WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm

FP—

Package_SON

WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))

Pads: 9
SMD: 8.7×6.5
Boards: 20

DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm

FP—

Package_DFN_QFN

DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf)

Pads: 9
SMD: 4.2×2.5
Boards: 19

SOIC-8_7.5x5.85mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)

Pads: 8
SMD: 13.0×6.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 17

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.514x3.2mm

FP—

Package_SO

SOIC, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13)

Pads: 9
SMD: 7.4×5.4
Boards: 17

Hirose_DF13-08P-1.25DSA_1x08_P1.25mm_Vertical

FP—

Connector_Hirose

Hirose DF13 through hole, DF13-08P-1.25DSA, 8 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/)

Pads: 8
THT: 12.7×4.4
Boards: 16

Molex_PicoBlade_53047-0810_1x08_P1.25mm_Vertical

FP—

Connector_Molex

Molex PicoBlade Connector System, 53047-0810, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf)

Pads: 8
THT: 12.8×4.2
Boards: 16

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.71x3.4mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (JEDEC MS-012 variation BA (thermally enhanced), using tolerances and Exposed Pad from Texas Instruments DDA0008B, https://www.ti.com/lit/ml/pptd058j/pptd058j.pdf, https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=35, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012)

Pads: 9
SMD: 7.4×5.4
Boards: 16

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: 14

HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias

FP3D

Package_SO

HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 14

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads: 9
SMD: 6.3×3.5
Boards: 14

DFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.6mm

FP—

Package_DFN_QFN

DFN, 8 Pin (https://www.qorvo.com/products/d/da007268)

Pads: 9
SMD: 3.2×2.5
Boards: 13

DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm

FP3D

Package_DFN_QFN

DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081702_c_ddb8.pdf)

Pads: 9
SMD: 3.3×3.5
Boards: 13

NXP_LGA-8_3x5mm_P1.25mm_H1.1mm

FP—

Package_LGA

NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42)

Pads: 8
SMD: 4.0×5.5
Boards: 13

HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.3x2.3mm

FP—

Package_SO

HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf)

Pads: 9
SMD: 7.4×5.4
Boards: 13

VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm

FP—

Package_SON

VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)

Pads: 9
SMD: 4.3×3.5
Boards: 13

TerminalBlock_Phoenix_MKDS-1,5-8-5.08_1x08_P5.08mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix MKDS-1,5-8-5.08, 8 pins, pitch 5.08mm, size 40.6x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf

Pads: 8
THT: 41.6×10.8
Boards: 13

TDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF)

Pads: 9
SMD: 3.3×2.5
Boards: 12

TerminalBlock_Phoenix_PT-1,5-8-5.0-H_1x08_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-8-5.0-H, 8 pins, pitch 5mm, size 40x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf

Pads: 8
THT: 41.0×10.0
Boards: 12