Footprints
6,681 footprints matching “F”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
Fiducial_0.5mm_Mask1mm
Fiducial
Fiducial, circular marking, 0.5mm bare copper, 1mm soldermask opening (Level C)
- Pads
- —
- SMD
- 1.5×1.5
- Boards
- 161
Fuse_1812_4532Metric
Fuse
Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf)
- Pads
- 2
- SMD
- 5.9×3.9
- Boards
- 160
U.FL_Hirose_U.FL-R-SMT-1_Vertical
Connector_Coaxial
Hirose U.FL Coaxial (https://www.hirose.com/en/product/document?clcode=CL0331-0472-2-01&productname=U.FL-R-SMT-1(01)&series=U.FL&documenttype=2DDrawing&lang=en&documentid=0000940668)
- Pads
- 2
- SMD
- 4.3×5.0
- Boards
- 158
ESP32-WROOM-32D
RF_Module
2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.5×41.5
- Boards
- 155
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
U.FL_Molex_MCRF_73412-0110_Vertical
Connector_Coaxial
Molex Microcoaxial RF Connectors (MCRF), mates Hirose U.FL, (http://www.molex.com/pdm_docs/sd/734120110_sd.pdf)
- Pads
- 2
- SMD
- 5.0×5.0
- Boards
- 137
InvenSense_QFN-24_4x4mm_P0.5mm
Sensor_Motion
24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 5.3×5.3
- Boards
- 136
PinHeader_2x07_P1.27mm_Vertical_SMD
Connector_PinHeader_1.27mm
surface-mounted straight pin header, 2x07, 1.27mm pitch, double rows
- Pads
- 14
- SMD
- 8.6×9.9
- Boards
- 130
Fuse_1812_4532Metric_Pad1.30x3.40mm_HandSolder
Fuse
Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf)
- Pads
- 2
- SMD
- 6.3×3.9
- Boards
- 126
microSD_HC_Hirose_DM3AT-SF-PEJM5
Connector_Card
Micro SD, SMD, right-angle, push-pull (https://www.hirose.com/product/en/download_file/key_name/DM3AT-SF-PEJM5/category/Drawing%20(2D)/doc_file_id/44099/?file_category_id=6&item_id=06090031000&is_series=)
- Pads
- 11
- SMD
- 15.7×17.7
- Boards
- 120
Fiducial_0.75mm_Mask1.5mm
Fiducial
Fiducial, circular marking, 0.75mm bare copper, 1.5mm soldermask opening (Level B)
- Pads
- —
- SMD
- 2.0×2.0
- Boards
- 115
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
Relay_SPDT_SANYOU_SRD_Series_Form_C
Relay_THT
relay Sanyou SRD series Form C http://www.sanyourelay.ca/public/products/pdf/SRD.pdf
- Pads
- 5
- THT
- 20.1×15.9
- Boards
- 115
SMA_Amphenol_901-144_Vertical
Connector_Coaxial
https://www.amphenolrf.com/library/download/link/link_id/593640/parent/901-144/
- Pads
- 2
- THT
- 8.3×8.3
- Boards
- 112
USB_A_Molex_67643_Horizontal
Connector_USB
USB type A, Horizontal, https://www.molex.com/pdm_docs/sd/676433910_sd.pdf
- Pads
- 5
- THT
- 17.2×16.3
- Boards
- 109
AMASS_XT60-M_1x02_P7.20mm_Vertical
Connector_AMASS
AMASS female XT60, through hole, vertical, https://www.tme.eu/Document/2d152ced3b7a446066e6c419d84bb460/XT60%20SPEC.pdf
- Pads
- 2
- THT
- 16.5×9.2
- Boards
- 108
Fuse_0805_2012Metric_Pad1.15x1.40mm_HandSolder
Fuse
Fuse SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)
- Pads
- 2
- SMD
- 3.7×1.9
- Boards
- 107
Pin_D1.0mm_L10.0mm
Connector_Pin
solder Pin_ diameter 1.0mm, hole diameter 1.0mm (press fit), length 10.0mm
- Pads
- 1
- THT
- 3.0×3.0
- Boards
- 106
C_Rect_L7.2mm_W2.5mm_P5.00mm_FKS2_FKP2_MKS2_MKP2
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7.2*2.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_2.pdf
- Pads
- 2
- THT
- 7.7×3.0
- Boards
- 105
HOPERF_RFM9XW_SMD
RF_Module
Low Power Long Range Transceiver Module SMD-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf)
- Pads
- 16
- SMD
- 18.5×16.5
- Boards
- 105
SW_SPST_FSMSM
Button_Switch_SMD
http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=1437566-3&DocType=Customer+Drawing&DocLang=English
- Pads
- 2
- SMD
- 11.9×4.0
- Boards
- 104
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
USB_Micro-B_Amphenol_10103594-0001LF_Horizontal
Connector_USB
Micro USB Type B 10103594-0001LF, http://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10103594.pdf
- Pads
- 7
- SMD
- 8.3×6.5
- Boards
- 100