Footprints

1,441 footprints matching “MA”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,441 footprints · page 2 of 61

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WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Texas_DRC0010J_ThermalVias

FP—

Package_SON

Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf

Pads: 11
SMD: 3.9×3.9
Boards: 45

SMA_Samtec_SMA-J-P-H-ST-EM1_EdgeMount

FP3D

Connector_Coaxial

Connector SMA, 0Hz to 20GHz, 50Ohm, Edge Mount (http://suddendocs.samtec.com/prints/sma-j-p-x-st-em1-mkt.pdf)

Pads: 2
SMD: 14.7×8.0
Boards: 44

Fiducial_1mm_Mask3mm

FP—

Fiducial

Fiducial, circular marking, 1mm bare copper, 3mm soldermask opening (recommended)

Pads: —
SMD: 3.5×3.5
Boards: 44

ublox_MAX

FP—

RF_GPS

ublox MAX 6/7/8, (https://www.u-blox.com/sites/default/files/MAX-8-M8-FW3_HardwareIntegrationManual_%28UBX-15030059%29.pdf)

Pads: 18
SMD: 11.8×10.6
Boards: 44

D_SMA-SMB_Universal_Handsoldering

FP3D

Diode_SMD

Diode, Universal, SMA (DO-214AC) or SMB (DO-214AA), Handsoldering,

Pads: 2
SMD: 9.9×4.5
Boards: 40

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias

FP3D

Package_SO

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)

Pads: 9
SMD: 7.4×5.4
Boards: 40

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 38

Fuse_Littelfuse_395Series

FP—

Fuse

Fuse, TE5, Littelfuse/Wickmann, No. 460, No560,

Pads: 2
THT: 9.0×4.5
Boards: 36

RJ45_Amphenol_RJMG1BD3B8K1ANR

FP—

Connector_RJ

1 Port RJ45 Magjack Connector Through Hole 10/100 Base-T, AutoMDIX, https://www.amphenol-cs.com/media/wysiwyg/files/drawing/rjmg1bd3b8k1anr.pdf

Pads: 13
THT: 19.1×22.7
Boards: 35

SMA_Amphenol_901-143_Horizontal

FP—

Connector_Coaxial

Amphenol RF 901-143 https://www.amphenolrf.com/library/download/link/link_id/593645/parent/901-143/

Pads: 2
THT: 8.6×16.3
Boards: 34

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 34

Fiducial_1.5mm_Mask3mm

FP—

Fiducial

Fiducial, circular marking, 1.5mm bare copper, 3mm soldermask opening

Pads: —
SMD: 3.5×3.5
Boards: 33

VQFN-16-1EP_3x3mm_P0.5mm_EP1.68x1.68mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/tlv62095.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 33

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 32

MagneticBuzzer_ProSignal_ABT-410-RC

FP3D

Buzzer_Beeper

Buzzer, Elektromagnetic Beeper, Summer, 1,5V-DC,

Pads: 2
THT: 12.5×12.5
Boards: 31

AMASS_XT60PW-F_1x02_P7.20mm_Horizontal

FP—

Connector_AMASS

Connector XT60 Horizontal PCB Female, https://www.tme.eu/Document/1191bc2fa3aee3c446e5a895fd8f7983/XT60PW-F.pdf

Pads: 2
THT: 16.5×18.4
Boards: 31

USB_A_Stewart_SS-52100-001_Horizontal

FP—

Connector_USB

USB A connector https://belfuse.com/resources/drawings/stewartconnector/dr-stw-ss-52100-001.pdf

Pads: 5
THT: 17.3×15.0
Boards: 31

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 31