Footprints

1,663 footprints matching “Q”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

1,663 footprints · page 2 of 70

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TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads: 21
SMD: 4.3×4.3
Boards: 83

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)

Pads: 33
SMD: 6.3×6.3
Boards: 72

TestPoint_Pad_2.5x2.5mm

FP—

TestPoint

SMD rectangular pad as test Point, square 2.5mm side length

Pads: 1
SMD: 3.5×3.5
Boards: 72

TestPoint_THTPad_1.5x1.5mm_Drill0.7mm

FP—

TestPoint

THT rectangular pad as test Point, square 1.5mm side length, hole diameter 0.7mm

Pads: 1
THT: 2.5×2.5
Boards: 70

TestPoint_Pad_4.0x4.0mm

FP—

TestPoint

SMD rectangular pad as test Point, square 4.0mm side length

Pads: 1
SMD: 5.0×5.0
Boards: 67

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 64
SMD: 13.3×13.3
Boards: 58

TestPoint_Pad_3.0x3.0mm

FP—

TestPoint

SMD rectangular pad as test Point, square 3.0mm side length

Pads: 1
SMD: 4.0×4.0
Boards: 55

SW_Slide_SPDT_Angled_CK_OS102011MA1Q

FP3D

Button_Switch_THT

CuK miniature slide switch, OS series, SPDT, right angle, http://www.ckswitches.com/media/1428/os.pdf

Pads: 3
THT: 11.4×9.4
Boards: 54

QFN-48-1EP_7x7mm_P0.5mm_EP5.3x5.3mm

FP—

Package_DFN_QFN

QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2041_datasheet.pdf#page=62)

Pads: 49
SMD: 8.2×8.2
Boards: 53

TQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

TQFP, 144 Pin (JEDEC MS-026 variation AFB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 144
SMD: 23.3×23.3
Boards: 52

VQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm

FP—

Package_DFN_QFN

VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28)

Pads: 17
SMD: 4.3×4.3
Boards: 51

SW_SPST_SKQG_WithoutStem

FP3D

Button_Switch_SMD

ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html

Pads: 2
SMD: 8.5×5.7
Boards: 48

VQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm

FP—

Package_DFN_QFN

VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf)

Pads: 21
SMD: 4.2×4.2
Boards: 47

SolderWirePad_1x01_SMD_5x10mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 5mm x 10mm

Pads: 1
SMD: 5.3×10.3
Boards: 46

QSOP-16_3.9x4.9mm_P0.635mm

FP3D

Package_SO

QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 16
SMD: 7.4×5.4
Boards: 45

QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm

FP3D

Package_DFN_QFN

QFN, 16 Pin (https://www.st.com/resource/en/datasheet/tsv521.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: 44

SW_SPST_EVQPE1

FP3D

Button_Switch_SMD

Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf

Pads: 2
SMD: 7.9×4.0
Boards: 42

SolderWire-0.5sqmm_1x02_P4.6mm_D0.9mm_OD2.1mm

FP—

Connector_Wire

Soldered wire connection, for 2 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.50 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=9), bend radius 3 times outer diameter

Pads: 2
THT: 8.2×3.2
Boards: 41