Footprints
363 footprints matching “SON”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WSON-8-1EP_8x6mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44))
- Pads
- 9
- SMD
- 8.7×6.5
- Boards
- 20
Crystal_SMD_SeikoEpson_MC306-4Pin_8.0x3.2mm
Crystal
Seiko Epson MC-306, Crystal, 8.0x3.2mm package, SMD, https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf
- Pads
- 4
- SMD
- 9.0×5.6
- Boards
- 18
Resonator_SMD_Murata_CSTxExxV-3Pin_3.0x1.1mm_HandSoldering
Crystal
SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf
- Pads
- 3
- SMD
- 3.5×3.7
- Boards
- 18
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 18
WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65_ThermalVias
Package_SON
WSON-12 http://www.ti.com/lit/ds/symlink/lm27762.pdf
- Pads
- 13
- SMD
- 2.9×3.5
- Boards
- 18
Crystal_SMD_SeikoEpson_FA128-4Pin_2.0x1.6mm
Crystal
crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en), 2x1.6mm^2 package
- Pads
- 4
- SMD
- 3.0×2.6
- Boards
- 17
Oscillator_SMD_SeikoEpson_SG8002CE-4Pin_3.2x2.5mm
Oscillator
Seiko Epson SG-8002CE, Crystal Oscillator, 3.2x2.5mm package, SMD, https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC
- Pads
- 4
- SMD
- 4.3×3.6
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
VSON-8_3.3x3.3mm_P0.65mm_NexFET
Package_SON
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf
- Pads
- 5
- SMD
- 4.0×3.8
- Boards
- 16
Crystal_SMD_SeikoEpson_TSX3225-4Pin_3.2x2.5mm_HandSoldering
Crystal
Epson Toyocom TSX-3225, crystal, 3.2x2.5mm package, SMD, hand-soldering, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 5.5×4.4
- Boards
- 14
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 14
Texas_S-PDSO-N12
Package_SON
http://www.ti.com/lit/ds/symlink/bq27441-g1.pdf
- Pads
- 13
- SMD
- 4.9×3.4
- Boards
- 13
VSON-8-1EP_3x3mm_P0.65mm_EP1.65x2.4mm
Package_SON
VSON, 8 Pin (https://www.ti.com/lit/ds/symlink/tlv767-q1.pdf#page=31)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 13
Johanson_2450AT18x100
RF_Antenna
Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, -0.5dBi, https://www.johansontechnology.com/datasheets/2450AT18A100/2450AT18A100.pdf
- Pads
- 2
- SMD
- 4.6×2.3
- Boards
- 13
Battery_Panasonic_CR2032-HFN_Horizontal_CircularHoles
Battery
Panasonic CR-2032/HFN battery, https://industrial.panasonic.com/cdbs/www-data/pdf2/AAA4000/AAA4000D166.PDF
- Pads
- 2
- THT
- 22.6×20.5
- Boards
- 12
USON-20_2x4mm_P0.4mm
Package_SON
USON-20 2x4mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf
- Pads
- 20
- SMD
- 3.3×4.5
- Boards
- 12
Crystal_SMD_SeikoEpson_FA238-4Pin_3.2x2.5mm_HandSoldering
Crystal
Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, hand-soldering, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 5.5×4.5
- Boards
- 11
Resonator-2Pin_W8.0mm_H3.5mm
Crystal
Ceramic Resonator/Filter, length 3.5mm, width 8.0mm, 2 pins
- Pads
- 2
- THT
- 9.0×4.5
- Boards
- 10
SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
Package_SON
SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf)
- Pads
- 9
- SMD
- 3.6×2.5
- Boards
- 10
Crystal_SMD_SeikoEpson_FA238V-4Pin_3.2x2.5mm
Crystal
Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 4.3×3.6
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9
Infineon_PG-TDSON-8_6.15x5.15mm
Package_SON
Infineon, PG-TDSON-8, 6.15x5.15x1mm, https://www.infineon.com/dgdl/Infineon-BSC520N15NS3_-DS-v02_02-en.pdf?fileId=db3a30432239cccd0122eee57d9b21a4
- Pads
- 5
- SMD
- 7.4×5.6
- Boards
- 9
Texas_S-PWSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf
- Pads
- 11
- SMD
- 4.3×4.1
- Boards
- 9