Footprints

209 footprints matching “TSSOP”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

209 footprints · page 2 of 9

Matched by name and keywords. Search by meaning instead

TSSOP-24_6.1x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
24
SMD
9.4×8.3
Boards
7

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias

FP3D

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads
21
SMD
7.8×7.0
Boards
6

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.85x4mm

FP—

Package_SO

HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads
21
SMD
7.7×7.0
Boards
4

HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm

FP—

Package_SO

HTSSOP, 24 Pin (JEDEC MO-153 variation ADT, 1.00mm body thickness, custom Exposed Pad size from STMicroelectronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25, https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37)

Pads
25
SMD
7.8×8.3
Boards
4

TSSOP-14-1EP_4.4x5mm_P0.65mm

FP3D

Package_SO

14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf)

Pads
15
SMD
7.9×5.6
Boards
4

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm_ThermalVias

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads
17
SMD
7.8×5.5
Boards
3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads
29
SMD
7.8×10.2
Boards
3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads
29
SMD
7.8×10.2
Boards
3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads
29
SMD
7.7×10.2
Boards
3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
3

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm_ThermalVias

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads
17
SMD
7.8×5.5
Boards
3

TSSOP-30_4.4x7.8mm_P0.5mm

FP3D

Package_SO

TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
30
SMD
7.7×8.3
Boards
3

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.74x3.86mm

FP—

Package_SO

HTSSOP, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4011fb.pdf#page=24)

Pads
21
SMD
7.7×7.0
Boards
2

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
2

HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm

FP3D

Package_SO

HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)

Pads
33
SMD
9.0×11.6
Boards
2

Texas_DYY0016A_TSOT-23-16_2x4.2mm_P0.5mm

FP—

Package_SO

Texas DYY0016A TSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tmux1574.pdf#page=42)

Pads
16
SMD
4.6×4.7
Boards
2

Texas_PWP0020A

FP3D

Package_SO

20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)

Pads
21
SMD
8.2×7.0
Boards
2

TSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm

FP—

Package_SO

TSSOP, 16 Pin (Allegro A4954 https://www.allegromicro.com/-/media/Files/Datasheets/A4954-Datasheet.ashx)

Pads
17
SMD
7.8×5.5
Boards
2

TSSOP-20_4.4x5mm_P0.5mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
20
SMD
7.7×5.5
Boards
2

TSSOP-24_4.4x5mm_P0.4mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
24
SMD
7.7×5.5
Boards
2

TSSOP-28_6.1x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
28
SMD
9.4×10.2
Boards
2

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm

FP—

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads
29
SMD
7.7×10.2
Boards
2

TSSOP-4_4.4x5mm_P4mm

FP—

Package_SO

TSSOP, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4)

Pads
4
SMD
7.9×5.5
Boards
2

TSSOP-44_4.4x11.2mm_P0.5mm

FP3D

Package_SO

TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)

Pads
44
SMD
7.4×11.9
Boards
2