497 footprints matching “53”

LED_THT

Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf

Pads

2

THT

7.0×6.8

Boards

—

Mounting_Wuerth

Mounting Hardware, inside through hole M3, height 0.5, Wuerth electronics 9774005360 (https://www.we-online.com/components/products/datasheet/9774005360R.pdf)

Pads

1

SMD

7.9×7.9

Boards

—

Mounting_Wuerth

Mounting Hardware, inside through hole M3, height 1.5, Wuerth electronics 9774015360 (https://www.we-online.com/components/products/datasheet/9774015360R.pdf)

Pads

1

SMD

7.9×7.9

Boards

—

muratovas-MAS_Package_nostd

Pads

6

SMD

5.4×3.4

Boards

—

muratovas-MAS_Package_nostd

Pads

2

SMD

6.2×3.0

Boards

—

muratovas-MAS_Package_nostd

8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils)

Pads

8

SMD

12.1×10.7

Boards

—

muratovas-MAS_Package_nostd

Power inductor SMD 0530 (5.4x5.2x3mm)

Pads

2

SMD

8.9×7.0

Boards

—

muratovas-MAS_Package_std

Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator

Pads

2

SMD

5.9×3.9

Boards

—

muratovas-MAS_Package_std

Power inductor SMD 0530 (5.4x5.2x3mm)

Pads

2

SMD

6.6×5.6

Boards

—

muratovas-MAS_Package_std

TFBGA-153_11.5x13mm_P0.5mm

Pads

153

SMD

12.0×13.5

Boards

—

OptoDevice

Broadcom LGA, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN)

Pads

8

SMD

2.6×2.5

Boards

—

Package_BGA

Altera MBGA-153, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00471-00.pdf

Pads

153

SMD

10.0×10.0

Boards

—

Package_BGA

FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf

Pads

780

SMD

25.0×25.0

Boards

—

Package_BGA

JEDEC eMMC AN BGA-153, 11.5x13.0mm, 153 Ball, 14x14 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf

Pads

153

SMD

13.5×15.0

Boards

—

Package_BGA

FCSG536, 16.0x16.0mm, 536 Ball, 30x30 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads

536

SMD

18.0×18.0

Boards

—

Package_BGA

Texas Instruments, DSBGA, area grid, 3.415x3.535mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads

64

SMD

5.4×5.5

Boards

—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads

5

SMD

4.0×3.5

Boards

—

Package_CSP

Efinix WLCSP, NSMD pad definition Page 60, 3.5353x3.3753mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf#page=9

Pads

64

SMD

5.5×5.4

Boards

—

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

10

SMD

12.0×13.2

Boards

—

Package_DIP

10-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

10

SMD

11.5×13.2

Boards

—

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

12

SMD

12.0×15.7

Boards

—

Package_DIP

12-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

12

SMD

11.5×15.7

Boards

—

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

14

SMD

12.0×18.3

Boards

—

Package_DIP

14-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

14

SMD

11.5×18.3

Boards

—