Footprints

2,819 footprints matching “lead”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,819 footprints · page 20 of 118

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CERDIP-16_W7.62mm_SideBrazed_LongPads

FP—

Package_DIP

16-lead through-hole mounted CERDIP, JEDEC MS-015-AC package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 16
THT: 10.5×20.8
Boards: 3

CERDIP-28_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

28-lead through-hole mounted CERDIP, JEDEC MS-015-AH package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 28
THT: 10.7×36.2
Boards: 3

CERDIP-8_W7.62mm_SideBrazed_Socket

FP—

Package_DIP

8-lead through-hole mounted CERDIP, JEDEC MS-015-AA package, row spacing 7.62mm (300 mils), SideBrazed, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 8
THT: 10.7×13.8
Boards: 3

DIP-12_W10.16mm

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 12
THT: 12.3×15.7
Boards: 3

DIP-12_W7.62mm_LongPads

FP3D

Package_DIP

12-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 12
THT: 10.5×15.7
Boards: 3

DIP-4_W10.16mm_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 4
THT: 13.1×5.6
Boards: 3

DIP-4_W7.62mm_Socket_LongPads

FP3D

Package_DIP

4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 4
THT: 10.7×5.7
Boards: 3

DIP-8-N7_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7

Pads: 7
THT: 9.8×10.7
Boards: 3

PowerIntegrations_SMD-8

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 8
SMD: 11.1×10.7
Boards: 3

LGA-8_8x6mm_P1.27mm

FP—

Package_LGA

LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6)

Pads: 8
SMD: 9.2×6.5
Boards: 3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

PowerIntegrations_SO-8C

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: 3

SSOP-18_4.4x6.5mm_P0.65mm

FP3D

Package_SO

SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)

Pads: 18
SMD: 6.9×7.0
Boards: 3

HVSON-8-1EP_4x4mm_P0.8mm_EP2.2x3.1mm

FP—

Package_SON

HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf (page 57))

Pads: 9
SMD: 5.3×4.5
Boards: 3

Texas_S-PVSON-N8

FP3D

Package_SON

8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf

Pads: 9
SMD: 4.2×3.6
Boards: 3

Texas_VSON-HR-8_1.5x2mm_P0.5mm

FP3D

Package_SON

Texas VSON-HR, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29)

Pads: 8
SMD: 2.8×2.5
Boards: 3

WSON-8-1EP_3x3mm_P0.5mm_EP1.45x2.4mm

FP—

Package_SON

WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30)

Pads: 9
SMD: 4.3×3.5
Boards: 3

WSON-8-1EP_4x4mm_P0.8mm_EP2.2x3mm

FP—

Package_SON

WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2987.pdf#page=26)

Pads: 9
SMD: 4.5×4.5
Boards: 3

TO-220-15_P2.54x5.08mm_StaggerOdd_Lead4.58mm_Vertical

FP—

Package_TO_SOT_THT

TO-220-15, Vertical, RM 1.27mm, Multiwatt-15, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf

Pads: 15
THT: 20.7×11.0
Boards: 3

TO-220-7_P2.54x3.7mm_StaggerOdd_Lead3.8mm_Vertical

FP—

Package_TO_SOT_THT

TO-220-7, Vertical, RM 1.27mm, staggered type-1

Pads: 7
THT: 10.5×9.6
Boards: 3

TO-92_Inline_W4.0mm_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: 3

Transformer_ED8_4-Lead_10.5x8mm_P5mm

FP—

Transformer_SMD

Isolated audio transformer, ED8, 4-lead, body 10.5x8mm body, pitch 5mm, height 5mm, https://gitlab.com/kicad/libraries/kicad-footprints/-/merge_requests/3626

Pads: 4
SMD: 8.5×15.7
Boards: 3

Fuseholder_Clip-6.3x32mm_Littelfuse_102_Inline_P34.21x7.62mm_D2.54mm_Horizontal

FP—

Fuse

Fuseholder Clips, 6.3x32mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 102 Bowed Leads, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_102_122_datasheet.pdf.pdf

Pads: 2
THT: 38.2×8.9
Boards: 2