Footprints
5,977 footprints matching “8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PhoenixContact_MSTBVA_2,5_4-G-5,08_1x04_P5.08mm_Vertical
Connector_Phoenix_MSTB
Generic Phoenix Contact connector footprint for: MSTBVA_2,5/4-G-5,08; number of pins: 04; pin pitch: 5.08mm; Vertical || order number: 1755752 12A || order number: 1924321 16A (HC)
- Pads
- 4
- THT
- 23.3×9.6
- Boards
- 9
PinSocket_1x08_P1.27mm_Vertical
Connector_PinSocket_1.27mm
Through hole straight socket strip, 1x08, 1.27mm pitch, single row (from Kicad 4.0.7), script generated
- Pads
- 8
- THT
- 3.5×11.2
- Boards
- 9
PinSocket_1x08_P2.54mm_Vertical_SMD_Pin1Left
Connector_PinSocket_2.54mm
surface-mounted straight socket strip, 1x08, 2.54mm pitch, single row, style 1 (pin 1 left) (https://cdn.harwin.com/pdfs/M20-786.pdf), script generated
- Pads
- 8
- SMD
- 6.2×21.5
- Boards
- 9
SolderWire-2sqmm_1x02_P7.8mm_D2mm_OD3.9mm
Connector_Wire
Soldered wire connection, for 2 times 2 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://www.staubli.com/content/dam/ecs/catalogs-brochures/TM/CAB-Main-11014119-en.pdf#page=11), bend radius 3 times outer diameter
- Pads
- 2
- THT
- 13.2×4.9
- Boards
- 9
Crystal_HC18-U_Horizontal_1EP_style2
Crystal
HC18/U, Crystal, length 13.0mm, width 10.9mm, THT, http://5hertz.com/pdfs/04404_D.pdf
- Pads
- 3
- THT
- 13.5×17.8
- Boards
- 9
Crystal_SMD_G8-2Pin_3.2x1.5mm_HandSoldering
Crystal
Diodes Inc. G8, Crystal, 3.2x1.5mm package, SMD, hand-soldering, https://www.diodes.com/datasheet/download/g8.pdf
- Pads
- 2
- SMD
- 5.5×2.5
- Boards
- 9
Crystal_SMD_SeikoEpson_FA238V-4Pin_3.2x2.5mm
Crystal
Epson Toyocom FA-238, crystal, 3.2x2.5mm package, SMD, http://www.mouser.com/ds/2/137/1721499-465440.pdf
- Pads
- 4
- SMD
- 4.3×3.6
- Boards
- 9
Nexperia_DSN1608-2_1.6x0.8mm
Diode_SMD
Diode SMD DSN1608, 1.6 x 0.8 x 0.29 mm, https://assets.nexperia.com/documents/package-information/SOD964.pdf
- Pads
- 2
- SMD
- 2.1×1.3
- Boards
- 9
D_DO-34_SOD68_P2.54mm_Vertical_AnodeUp
Diode_THT
Diode, DO-34_SOD68 series, Axial, Vertical, pin pitch=2.54mm, length*diameter=3.04*1.6mm^2, https://www.nxp.com/docs/en/data-sheet/KTY83_SER.pdf
- Pads
- 2
- THT
- 4.6×2.1
- Boards
- 9
L_Wuerth_WE-TPC-3816
Inductor_SMD
L_Wuerth_WE-TPC-3816 StepUp generated footprint, http://katalog.we-online.de/pbs/datasheet/7440310047.pdf
- Pads
- 2
- SMD
- 4.8×4.8
- Boards
- 9
BGA-121_9.0x9.0mm_Layout11x11_P0.8mm_Ball0.4mm_Pad0.35mm_NSMD
Package_BGA
121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213)
- Pads
- 121
- SMD
- 11.0×11.0
- Boards
- 9
DFN-8_2x2mm_P0.5mm
Package_DFN_QFN
DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF
- Pads
- 8
- SMD
- 3.3×2.7
- Boards
- 9
DFN-8-1EP_3x3mm_P0.65mm_EP1.7x2.05mm
Package_DFN_QFN
DFN, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf)
- Pads
- 9
- SMD
- 4.2×3.5
- Boards
- 9
PQFN-8-EP_6x5mm_P1.27mm_Generic
Package_DFN_QFN
Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf
- Pads
- 5
- SMD
- 7.3×5.8
- Boards
- 9
QFN-28-1EP_4x4mm_P0.45mm_EP2.4x2.4mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 9
QFN-28-1EP_4x4mm_P0.4mm_EP2.3x2.3mm
Package_DFN_QFN
QFN, 28 Pin (http://www.issi.com/WW/pdf/31FL3731.pdf#page=21)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- 9
QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 9
QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm_ThermalVias
Package_DFN_QFN
QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 9
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
Diodes_PSOP-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- 9
ONSemi_SO-8FL_488AA
Package_SO
ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF
- Pads
- 5
- SMD
- 7.0×6.1
- Boards
- 9
Texas_R-PDSO-G8_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
HSOIC, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 9
HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
Package_SON
HVSON, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 9