Footprints

2,236 footprints matching “54”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,236 footprints · page 26 of 94

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PinSocket_2x17_P2.54mm_Horizontal

FP3D

Connector_PinSocket_2.54mm

Through hole angled socket strip, 2x17, 2.54mm pitch, 8.51mm socket length, double rows (from Kicad 4.0.7), script generated

Pads: 34
THT: 14.8×44.2
Boards: 2

PinSocket_2x38_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 2x38, 2.54mm pitch, double rows (from Kicad 4.0.7), script generated

Pads: 76
THT: 6.1×97.5
Boards: 2

Samtec_HLE-107-02-xxx-DV-BE-A_2x07_P2.54mm_Horizontal

FP—

Connector_Samtec_HLE_SMD

Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-107-02-xxx-DV-BE-A, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf)

Pads: 14
SMD: 18.8×8.1
Boards: 2

Converter_DCDC_RECOM_R-78S-0.1_THT

FP3D

Converter_DCDC

DCDC-Converter, RECOM, RECOM_R-78S-0.1, SIP-4, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf

Pads: 4
THT: 12.1×9.0
Boards: 2

Converter_DCDC_TRACO_TSR2-24xxN_TSR2-24xxxN_THT

FP—

Converter_DCDC

DCDC-Converter, TRACO, TSR2-24xxN, TSR2-24xxxN, 2A, Rev. December 19. 2024, https://www.tracopower.com/products/tsr2n.pdf

Pads: 3
THT: 9.1×15.5
Boards: 2

Converter_DCDC_TRACO_TSR2-xxxx_THT

FP—

Converter_DCDC

DCDC-Converter, TRACO, TSR2-xxxx, 2A, Rev. January 20. 2025, https://www.tracopower.com/products/tsr2.pdf

Pads: 3
THT: 9.0×15.5
Boards: 2

Fuseholder_Clip-6.3x32mm_Littelfuse_102_Inline_P34.21x7.62mm_D2.54mm_Horizontal

FP—

Fuse

Fuseholder Clips, 6.3x32mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 102 Bowed Leads, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_102_122_datasheet.pdf.pdf

Pads: 2
THT: 38.2×8.9
Boards: 2

Fuseholder_Clip-6.3x32mm_Littelfuse_122_Inline_P34.21x7.62mm_D2.54mm_Horizontal

FP—

Fuse

Fuseholder Clips, 6.3x32mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 122 Bowed Leads, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_102_122_datasheet.pdf.pdf

Pads: 2
THT: 38.2×8.4
Boards: 2

CERDIP-14_W7.62mm_SideBrazed

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 9.7×19.6
Boards: 2

CERDIP-14_W7.62mm_SideBrazed_LongPads_Socket

FP—

Package_DIP

14-lead through-hole mounted CERDIP, JEDEC MS-015-AB package, row spacing 7.62mm (300 mils), SideBrazed, LongPads, Socket, https://www.jedec.org/system/files/docs/Ms-015a.pdf

Pads: 14
THT: 10.7×19.7
Boards: 2

DIP-14_W10.16mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 14
THT: 13.1×18.3
Boards: 2

DIP-14_W8.89mm_SMDSocket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads

Pads: 14
SMD: 12.5×18.4
Boards: 2

DIP-24_W10.16mm_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 24
THT: 13.1×31.0
Boards: 2

DIP-28_W7.62mm_SMDSocket_SmallPads

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads

Pads: 28
SMD: 10.7×36.2
Boards: 2

DIP-64_W22.86mm_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), LongPads

Pads: 64
THT: 25.8×81.8
Boards: 2

DIP-64_W25.4mm

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils)

Pads: 64
THT: 27.5×81.8
Boards: 2

DIP-64_W25.4mm_Socket_LongPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 25.4mm (1000 mils), Socket, LongPads

Pads: 64
THT: 28.4×81.9
Boards: 2

DIP-8-16_W7.62mm

FP—

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×20.8
Boards: 2

PowerIntegrations_SMD-8B

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
SMD: 11.1×10.7
Boards: 2