Footprints
719 footprints matching “thermal”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WQFN-38-1EP_5x7mm_P0.5mm_EP3.65x5.65mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-42-1EP_3.5x9mm_P0.5mm_EP2.05x7.55mm_ThermalVias
Package_DFN_QFN
WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23, https://www.diodes.com/assets/Package-Files/PD-2035J_ZH42.pdf)
- Pads
- 43
- SMD
- 4.8×10.3
- Boards
- —
Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias
Package_LGA
Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)
- Pads
- 9
- SMD
- 3.4×3.5
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP4x4mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP5x5mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP6.61x5.615mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP7.2x6.35mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
EQFP-144-1EP_20x20mm_P0.5mm_EP8.93x8.7mm_ThermalVias
Package_QFP
EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
LQFP-100-1EP_14x14mm_P0.5mm_EP6.9x6.9mm_ThermalVias
Package_QFP
LQFP, 100 Pin (JEDEC MS-026 variation BED with exposed pad, 1.60mm max body thickness, https://www.jedec.org/system/files/docs/MS-026D.pdf, https://www.nxp.com/docs/en/package-information/SOT2229-1.pdf)
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
LQFP-144-1EP_20x20mm_P0.5mm_EP6.5x6.5mm_ThermalVias
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, custom Exposed Pad from Infineon, https://www.infineon.com/dgdl/Infineon-XMC4500-DS-v01_05-EN.pdf#page=107, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 145
- SMD
- 23.3×23.3
- Boards
- —
LQFP-176-1EP_24x24mm_P0.5mm_EP6.6x6.6mm_ThermalVias
Package_QFP
LQFP, 176 Pin (https://www.infineon.com/cms/en/product/packages/PG-TQFP/PG-TQFP-176-801/)
- Pads
- 177
- SMD
- 27.4×27.4
- Boards
- —
LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm_ThermalVias
Package_QFP
LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
Texas_PHP0048E_HTQFP-48-1EP_7x7mm_P0.5mm_EP6.5x6.5mm_Mask3.62x3.62mm_ThermalVias
Package_QFP
Texas PHP0048E HTQFP, 48 Pin (https://www.ti.com/lit/ds/symlink/tusb4020bi.pdf#page=42)
- Pads
- 49
- SMD
- 10.4×10.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask4.44x4.44mm_ThermalVias
Package_QFP
Texas TQFP, 64 Pin (Texas PAP0064M, based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd078j/pptd078j.pdf, https://www.ti.com/lit/ds/symlink/tusb4041i.pdf#page=40)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
Texas_TQFP-64-1EP_10x10mm_P0.5mm_EP8x8mm_Mask5x5mm_ThermalVias
Package_QFP
Texas TQFP, 64 Pin (Texas PAP (S-PQFP-G64), based on JEDEC MS-026 variation ACD, 1.00mm body thickness, https://www.ti.com/lit/ds/symlink/tfp410.pdf#page=41)
- Pads
- 65
- SMD
- 13.4×13.4
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-64-1EP_10x10mm_P0.5mm_EP5.305x5.305mm_ThermalVias
Package_QFP
TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)
- Pads
- 65
- SMD
- 13.5×13.5
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 37
- SMD
- 15.9×16.6
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.44x3.42mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024U, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd402/pptd402.pdf, https://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=50, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x2.98mm_ThermalVias
Package_SO
HTSSOP, 24 Pin (Texas Instruments PWP0024P, based on JEDEC MO-153 variation ADT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd064i/pptd064i.pdf, https://web.archive.org/web/20170223145154/http://www.ti.com/lit/ds/symlink/tlc5949.pdf#page=49, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —